Dr
Richard Bates
(University of Glasgow)
16/04/2008, 09:30
Radiation hardness properties of 3D detectors (results and simulations)
The different process stages required to fabricate a 3D detector is described. As a consequence of this a non-standard silicon detector manufacture was identified as a potential vendor. A detailed description of the process flow is presented followed by a discussion of process optimization. The first results of devices from the company are shown and lessons learnt expanded upon. From these...
Dr
Angela Kok
(SINTEF)
16/04/2008, 10:00
Radiation hardness properties of 3D detectors (results and simulations)
3D detectors, with vertical electrodes penetrating through the entire silicon substrate have drawn high interests for future particle tracking and medical imaging applications due to their unique advantages such as ultra-fast time response, edgeless capability, low initial depletion voltage and radiation hardness. In addition, the through-wafer electrode technology can provide the possibility...
Maurizio Boscardin
(Fondazione Bruno Kessler)
16/04/2008, 10:30
Radiation hardness properties of 3D detectors (results and simulations)
The status of 3D detector development at FBK-irst will be reviewed.
In particular, we will present the fabrication process of the double-sided, double-type 3D detectors (3D-DDTC) along with selected results from the experimental characterization of detectors and test structures from the first 3D-DDTC batch made on n-substrates.
Andrea Zoboli
(Universita' di Trento e INFN)
16/04/2008, 10:45
Radiation hardness properties of 3D detectors (results and simulations)