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Description
Summary
The ATLAS FE-I4 ROIC is almost 20 mm x 20 mm in size with order 10 micrometers of metal and dielectrics above the CMOS implants. When the die is thinned to a few hundred micrometers it tends to bow due to the stress in the dielectric/metal layers no longer being resisted by a thick silicon substrate. This bowing is increased further at elevated temperatures due to the different coefficient of thermal expansions of the dielectric/metal layers and silicon substrate. Solder based bump-bonding takes place typically at 260C and will increase the bow of the die significantly to several hundred micrometers. The size of the solder bumps are only 25 micrometers in diameter. Therefore, bowing of the ROIC will cause issues with the yield of the solder connections as they will not make electrical connection with the sensor and ROIC.
The work will show that the bow of the die can be affected with the use of a post-processed dielectric layer deposited on the backside of the wafer. The bow of the FE-I4 die as a function of die temperature for different backside dielectric deposition is shown. The details of the fabrication process and the characterisation techniques are described, as well as the final result. The processing technologies have been chosen to be compatible with both the existing CMOS ROIC but also with the through-silion-via, TSV, technology of the foundry.
