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2nd Summer School on INtelligent signal processing for FrontIEr Research and Industry

14–25 Jul 2014
University Paris-Diderot, Paris, France
Europe/Zurich timezone

Session

Second Morning Session

16 Jul 2014, 09:00
BioPark Auditorium and Physics Department, Building Condorcet (University Paris-Diderot, Paris, France)

BioPark Auditorium and Physics Department, Building Condorcet

University Paris-Diderot, Paris, France

Description

This session is dedicated to a series of lectures on Very Deep SubMicron CMOS Technologies, 3D technologies and New Packaging Technologies

Presentation materials

There are no materials yet.

  1. 7. Introduction to Very Deep Sub Micron CMOS technologies: the 65nm CMOS process for mixed mode analog-digital circuits
    Prof. Valerio Re (INFN and University of Bergamo (IT))
    16/07/2014, 09:00
  2. 8. Introduction to Very Deep SubMicron CMOS Technologies: FD-SOI technology for digital systems
    Dr Claire Fenouillet-Beranger (CEA-LETI (FR))
    16/07/2014, 10:00
  3. 9. 3D and Novel Packaging technologies
    Dr Robert Patti (Tezzaron Semiconductor (USA))
    16/07/2014, 11:30
  4. 38. 3D technologies: new era for packaging and IC development
    Dr Yann Lamy (CEA-LETI (FR))
    16/07/2014, 12:15
Building timetable...