2nd Summer School on INtelligent signal processing for FrontIEr Research and Industry

Session

Second Morning Session

16 Jul 2014, 09:00

BioPark Auditorium and Physics Department, Building Condorcet (University Paris-Diderot, Paris, France)

Description

This session is dedicated to a series of lectures on Very Deep SubMicron CMOS Technologies, 3D technologies and New Packaging Technologies

7. Introduction to Very Deep Sub Micron CMOS technologies: the 65nm CMOS process for mixed mode analog-digital circuits

Prof. Valerio Re (INFN and University of Bergamo (IT))

16/07/2014, 09:00

8. Introduction to Very Deep SubMicron CMOS Technologies: FD-SOI technology for digital systems

Dr Claire Fenouillet-Beranger (CEA-LETI (FR))

16/07/2014, 10:00

9. 3D and Novel Packaging technologies

Dr Robert Patti (Tezzaron Semiconductor (USA))

16/07/2014, 11:30

38. 3D technologies: new era for packaging and IC development

Dr Yann Lamy (CEA-LETI (FR))

16/07/2014, 12:15