Speaker
Anocha Sanorit
(Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, Bangkok, THAILAND 10800)
Description
The effects of wire sweep within the integrated circuit (IC) packaging process were studied in this research. Wire sweep is a major criteria that causes the shortage of wire between adjacent areas such as die and mold compound. It occur from the molding process after the wire bonding process in IC assembly. In experiment, the parameters of wire sweep were varied by wire size from 0.7 to 1.0 mil, wire height were varied from 3.0 to 5.0 mil, and in board bond wire length were varied from 10%, 30%, and 50% respectively. The results revealed that the wire height and the inboard wire length were showed directly proportional to wire sweep. In the opposite way, the wire size was showed inversely proportional to wire sweep. Therefore, these parameters of wire were played the important rule in IC packaging process. It should be selected properly for reducing the lot reject rate.
Author
Anocha Sanorit
(Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, Bangkok, THAILAND 10800)
Co-authors
Mr
Chalermsak SUMITHPIBUL
(Engineering Department, UTAC Thai Limited, Bangkok, THAILAND 10260)
Dr
Kessararat UGSORNRAT
(Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, Bangkok, THAILAND 10800)
