20-22 May 2015
Asia/Bangkok timezone
The Centennial Celebration of General Relativity Theory and 80 Years of Thai Physics Graduate

Correlation factors of wire sweep between wire bond and mold to establish process design rule

20 May 2015, 14:00
3h 30m
Board: MAG-06
Poster presentation Magnetic and Semiconductor Physics Poster-1

Speaker

Anocha Sanorit (Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, Bangkok, THAILAND 10800)

Description

The effects of wire sweep within the integrated circuit (IC) packaging process were studied in this research. Wire sweep is a major criteria that causes the shortage of wire between adjacent areas such as die and mold compound. It occur from the molding process after the wire bonding process in IC assembly. In experiment, the parameters of wire sweep were varied by wire size from 0.7 to 1.0 mil, wire height were varied from 3.0 to 5.0 mil, and in board bond wire length were varied from 10%, 30%, and 50% respectively. The results revealed that the wire height and the inboard wire length were showed directly proportional to wire sweep. In the opposite way, the wire size was showed inversely proportional to wire sweep. Therefore, these parameters of wire were played the important rule in IC packaging process. It should be selected properly for reducing the lot reject rate.

Primary author

Anocha Sanorit (Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, Bangkok, THAILAND 10800)

Co-authors

Mr Chalermsak SUMITHPIBUL (Engineering Department, UTAC Thai Limited, Bangkok, THAILAND 10260) Dr Kessararat UGSORNRAT (Department of Industrial Physics and Medical Instrumentation, Faculty of Science, King Mongkut's University of Technology North Bangkok, Bangkok, THAILAND 10800)

Presentation Materials

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