Speaker
Dr
Alexander Lawerenz
(CiS Forschungsinstitut fuer Mikrosensorik)
Description
Smaller dimensions for CMS and ATLAS pixel sensors require smaller dimensions for the under bump metallisation (UBM) and for the solder bumps which are connecting the radiation sensors to the FE-I chips. Whereas 40 to 50 µm large solder bumps are state of the art, future bumps have to be smaller than 30 µm. Another future task is to increase the number of solder bumps per area. CiS is working at overcoming these challenges by applying maskless, less expensive technologies as (single) solder ball placement and light induced plating.
Author
Dr
Alexander Lawerenz
(CiS Forschungsinstitut fuer Mikrosensorik)
Co-authors
Arno Kompatscher
(CiS Forschungsinstitut fuer Mikrosensorik)
Christian Maier
(CiS Forschungsinstitut fuer Mikrosensorik)
Ralf Röder
(CiS Forschungsinstitut fuer Mikrosensorik)
Sabine Nieland
(CiS Forschungsinstitut fuer Mikrosensorik)
Tobias Wittig
(CiS Forschungsinstitut fuer Mikrosensorik)
