Conveners
Technological improvements
- Ivan Vila Alvarez (Universidad de Cantabria (ES))
Esa Tuovinen
(Helsinki Institute of Physics (FI))
23/06/2015, 12:25
Standard (20 min including discussion)
Atomic layer deposition (ALD) is well-established and reliable method for depositing thin film layers. Earlier we have demonstrated the use of ALD alumina (Al2O3) layers in the passivation of p-type silicon sensors. With alumina passivation we can leave out p-stop and p-spray structures and, thus, simplify the sensor manufacturing process. In the sensors used in the future upgrades of LHC...
Miguel Ullan Comes
(CNM-Barcelona (ES))
23/06/2015, 12:45
Standard (20 min including discussion)
A status will be given on the proposal of the use of a second metal layer for the integration of pitch adaptors in the fabrication of large-área strip sensors for high energy physics experiments.
Dr
Alexander Lawerenz
(CiS Forschungsinstitut fuer Mikrosensorik)
23/06/2015, 13:05
Standard (20 min including discussion)
Smaller dimensions for CMS and ATLAS pixel sensors require smaller dimensions for the under bump metallisation (UBM) and for the solder bumps which are connecting the radiation sensors to the FE-I chips. Whereas 40 to 50 µm large solder bumps are state of the art, future bumps have to be smaller than 30 µm. Another future task is to increase the number of solder bumps per area. CiS is working...
