For the HL-LHC pixel detector upgrades, pixel sensors with small pixel size of 50x50 and 25x100 µm² are envisaged.
At CNM, a first run of small-pitch 3D sensors was produced, which are designed to be matched to existing front-end chips like the ATLAS FE-I4. Pixel detectors were bump-bonded and assembled at IFAE Barcelona and tested in the laboratory and beam tests at CERN before and after irradiation. Also strip and pad diodes were studied with IV characteristics and TCT. This talk will present an update of recently achieved results and give an overview on the plans for future developments.