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12th "Trento" Workshop on Advanced Silicon Radiation Detectors

20–22 Feb 2017
FBK, Trento
Europe/Zurich timezone

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Session

Session 2: Planar Sensors (1)

Pla 1
20 Feb 2017, 14:00
Aula Grande (FBK, Trento)

Aula Grande

FBK, Trento

Via Santa Croce, 77 38122 Trento ITALY

Conveners

Session 2: Planar Sensors (1)

  • Yoshinobu Unno (High Energy Accelerator Research Organization (JP))

Presentation materials

There are no materials yet.

  1. 5. Simulation of the depletion voltage evolution of the ATLAS Pixel Detector
    Julien-Christopher Beyer (Max-Planck-Institut fur Physik (DE))
    20/02/2017, 14:00
    Oral

    The ATLAS Pixel detector has been operating since 2010 and consists of hybrid pixel modules where the sensitive elements are planar n-in-n sensors.
    In order to investigate and predict the evolution of the depletion voltage and of the leakage current in the different layers, a fully analytical implementation of the Hamburg model was derived. The parameters of the model, describing the...

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  2. 26. Ongoing activities at CiS
    Mr Ralf Röder
    20/02/2017, 14:20
    Oral

    The CiS research institute is engaged in developments of radiation detector technologies on several different fields. Current projects are dealing e.g. with large area thinned sensors, active edge sensors, sensor-chip packaging technologies and defect engineering.
    For large area sensors, the need for smaller thicknesses can be approached by etching cavities to the sensors back side while...

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  3. 19. A Long-Term Annealing Study of Irradiated P-Type Sensors
    Ulrich Parzefall (Albert-Ludwigs-Universitaet Freiburg (DE))
    20/02/2017, 14:40
    Oral

    The silicon-based tracking detector systems in the HL-LHC upgrade will be exposed to highly adverse radiation conditions for more than a decade, without access options for service or repair. It is therefore imperative to understand and predict the long-term evolution of sensor properties, including the signal collection efficiency and the leakage current. In this context, we present a summary...

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  4. 6. Thin planar pixel sensor productions at MPP for the ATLAS ITk
    Anna Macchiolo (Max-Planck-Institut fur Physik (DE))
    20/02/2017, 15:00
    Oral

    The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system.
    Thin n-in-p planar pixel sensors are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation....

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  5. 65. Hybrid pixel modules and R&D on compact modules
    Susanne Kuehn (CERN)
    20/02/2017, 15:20
    Oral

    For the High-Luminosity upgrade of the LHC, a new pixel detector is foreseen for the ATLAS experiment. Currently, the prototyping phase is ongoing to build various detector components. The standard hybrid pixel modules consisting of a silicon pixel sensor and front-end electronics connected via bump-bonging are widely used. Prototypes with p-type sensors are built and tested.
    In addition, the...

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Building timetable...