Login

TWEPP 2018 Topical Workshop on Electronics for Particle Physics

17–21 Sept 2018
Europe/Zurich timezone

Support

Session

Production, Testing and Reliability

18 Sept 2018, 11:35

Conveners

Production, Testing and Reliability

  • Magnus Hansen (CERN)

Production, Testing and Reliability

  • Magnus Hansen (CERN)

Presentation materials

There are no materials yet.

  1. 92. Reliability test results of the interconnect structures of the front-end hybrids for the CMS Phase-2 Tracker Upgrade
    Mark Istvan Kovacs (CERN)
    18/09/2018, 11:35
    Production, Testing and Reliability
    Oral

    High Density Interconnect (HDI) hybrids are being developed for the CMS Tracker Phase Two Upgrade for the HL-LHC. These hybrids are carbon fibre reinforced flexible circuits with flip-chips, passives and connectors. Their operational lifetime is determined by the reliability of the solder joints of the surface mount components (flip-chips, passives, connectors) and the copper traces and vias...

    Go to contribution page
  2. 149. Test strategy for low failure rates and status of a highly integrated readout chip for PMTs in JUNO
    Dr André Zambanini (Forschungszentrum Jülich GmbH)
    18/09/2018, 12:00
    Production, Testing and Reliability
    Oral

    The Jiangmen Underground Neutrino Observatory (JUNO) is a multi-purpose underground experiment to determine the neutrino mass hierarchy as the main objective. The signal detection is performed by photomultipliers with readout electronics close to them. Therefore, a highly integrated analog-to-digital conversion unit with low power and large dynamic range is developed for PMT integration. To...

    Go to contribution page
  3. 161. Novel production method for large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR
    Patrick Pfistner (KIT)
    18/09/2018, 14:00
    Production, Testing and Reliability
    Oral

    The detector module of the Silicon Tracking System (STS) of the Compressed Baryonic Matter (CBM) experiment at FAIR (GSI) consists of double-sided silicon microstrip sensors with a size up to 124 mm x 62 mm which are connected to the read-out electronics by flexible microcables. The production of the detector modules faces several challenges. A new multilayer copper microcable with low...

    Go to contribution page
Building timetable...