TWEPP 2018 Topical Workshop on Electronics for Particle Physics

Session

Invited

17 Sept 2018, 16:20

Conveners

Invited

• Alessandro Marchioro (CERN)

Invited

• Christine Guo Hu (Centre National de la Recherche Scientifique (FR))

Invited

• Marcus Julian French (Science and Technology Facilities Council STFC (GB))

Invited

• Ken Wyllie (CERN)

Invited

• Grzegorz Deptuch (Fermi National Accelerator Lab. (US))

Invited

• Gregory Michiel Iles (Imperial College (GB))

Invited

• Gui Ping

Invited

• Philippe Farthouat (CERN)

189. Technology and challenges for extreme ultraviolet lithography

Van Der Zande Wim

17/09/2018, 16:20

Oral

ASML is an important player in the semiconductor industry. Using lithography, small structures are being written on wafers resulting in the active devices as we know them from servers, PCs and mobile phones.
In my talk I will sketch the technological challenges which ASML faces mechanical, electronical, and optical and sketch the progress over the last 30 years. The talk concentrates on the...

193. The CMS High Granularity Calorimeter for HL-LHC

David Barney (CERN)

18/09/2018, 10:45

Oral

Calorimetry in high-energy physics is rapidly evolving, with new challenges and a wide variety of technologies being employed, both for signal creation and detection. Advances in large-area highly-segmented detectors are providing possibilities for high-granularity calorimetry. The CMS HGCAL, being designed to replace the existing CMS endcap calorimeters for the HL-LHC era, is one example. It...

196. Silicon photonics for next-generation optical interconnects

Sebastien Lardenois (IMEC)

18/09/2018, 15:40

Oral

Demand for data communication in cloud data-centres is projected to continue to grow exponentially in the next few years.
In this presentation, we will discuss the opportunity and challenges related to silicon photonics technology as a short-reach optical interconnect platform. First, we will discuss the scaling trends and industry platform. Next, we will take a deep dive into the silicon...

199. Trends and challenges in monolithic CMOS sensor development for high energy physics

Walter Snoeys (CERN)

19/09/2018, 10:45

Oral

Hybrid pixel detectors are in overwhelming majority in today’s high energy physics experiments, but monolithic active pixel sensors (MAPS) in commercial CMOS technologies receive increasing interest due to their lower cost, easier detector assembly, and other advantages like lower material and higher granularity. Used for the first time in the STAR experiment, adopted for the ALICE experiment,...

194. It is Time to use Time (for Digital RF Clock Generation and Time-of-Flight)

Prof. R. Bogdan Staszewski (University College Dublin)

19/09/2018, 15:45

Oral

Unlike today when “digital turns into analog” and “analog turns into digital”, back in the late 1990s, the separation between analog and digital was unmistakable and vast. The design techniques, automation flow (or the lack of it), or even the way of designers' thinking were simply incompatible. Probably the only major area that was blurring these boundaries was a read channel for magnetic...

195. Bionic Hearing: the Science and the Experience

Shirpsey Ian (Oxford University)

20/09/2018, 10:45

Oral

Cochlear implants are the first device to successfully restore neural function. They have instigated a popular but controversial revolution in the treatment of deafness, and they serve as a model for research in neuroscience and biomedical engineering. After a visual tour of the physiology of natural hearing the function of cochlear implants will be described in the context of electrical...

200. Low noise global shutter pixels and readout circuits for CMOS image sensors

Guy Meynants

20/09/2018, 15:45

Oral

The read noise of CMOS image sensors has been reduced by a factor 10 in the last 15 years. As a result, photon-counting applications are now in reach with CMOS image sensor technology. The talk will address the most important measures that have led to this noise reduction, such as CMOS scaling, improved readout circuits and low-noise CMOS transistor process technology. In most cases, the...

201. Advanced packaging technologies for demanding HEP applications.

Stéphane Bellenger

21/09/2018, 10:45

Extreme miniaturization of packages and high-density interconnects are routinely demanded by many HEP applications. The following challenges are key to satisfy these demands:
- How to build smallest (volume, foot-print and weight) systems (Miniaturization)
- How to decrease the die spacing in-between individual sensor (Placement accuracy)
- How to integrate optical data transmission systems...