21-25 July 2019
Connecticut Convention Center, Level 6
US/Eastern timezone

M1Po2C-06 [40]: Influence of Curing Temperature on Thermal Conductivity and Electrical Insulation Properties of Epoxy/Aluminum Nitride Composites

22 Jul 2019, 14:00
2h
Level 6, Cryo Expo Exhibit Hall

Level 6, Cryo Expo Exhibit Hall

Speaker

Dr Teng Zhang (School of Electrical Engineering, Beijing Jiaotong University)

Description

Epoxy/aluminum nitride composites (EP/AlN) with high thermal conductivity, low thermal expansion and excellent insulation characteristics are particularly suitable for protecting a superconducting power equipment from the permanent damage of temperature rise and internal stress in quenching process. In this work, micro/nano AlN particles were used as fillers to improve the thermal conductivity and electrical insulation properties of neat epoxy. As a critical factor for the impregnation process, the effect of curing temperature on thermal conductivity and electrical insulation properties of AlN/EP were systematically investigated based on the AlN/EP samples (60% filler content of AlN-2μm and AlN-600nm (50%/50%)), which were respectively cured at temperature from 0oC to 80oC. Low curing temperature is advantageous for improving the thermal conductivity, volume resistivity, surface resistivity and surface flashover breakdown voltage of obtained epoxy composites, which is attributed to different dispersion states of AlN fillers in epoxy matrix. This study offers an experimental basis for the impregnation process and electrical application of dielectric polymer composites with high thermal conductivity in HTS equipment' manufacture.

Primary authors

Dr Teng Zhang (School of Electrical Engineering, Beijing Jiaotong University) Prof. Shaotao Dai (School of Electrical Engineering, Beijing Jiaotong University) Dr Tao Ma (School of Electrical Engineering, Beijing Jiaotong University) Dr Lei Hu (School of Electrical Engineering, Beijing Jiaotong University) Dr Bangzhu Wang (School of Electrical Engineering, Beijing Jiaotong University)

Presentation Materials

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