21–25 Jul 2019
Connecticut Convention Center, Level 6
US/Eastern timezone

Session

M3Or1B - Microelectronics I

M3Or1B
24 Jul 2019, 09:30
Level 6, Room 14

Level 6, Room 14

Conveners

M3Or1B - Microelectronics I

  • Thomas Bullard (UES Inc.)
  • Vyacheslav Solovyov (Brookhaven Technology Group)

Presentation materials

There are no materials yet.

  1. Dr Michael Hamilton (Auburn University)
    24/07/2019, 09:30
    Invited Oral Presentation

    Superconducting electronics (SCE) has experienced a recent surge in popularity due to a growing expectation of their use in future high-performance computing systems. This talk will cover two main topics that are important for integration of SCE systems: (1) superconducting flexible cables and (2) cable-to-cable connectors for superconducting flexible cables. Over the past several years, we...

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  2. Prof. Ke Chen (Temple University)
    24/07/2019, 10:00
    Invited Oral Presentation

    Planar MgB2 Josephson junctions and series arrays were fabricated by focused helium ion beam irradiation. This technique forms a junction barrier with the use of a 30 keV focused helium ion beam, nominal beam diameter of less than 0.5 nm and dose of 0.9 ~ 3 × 10^16 ions/cm^2, to locally damage a 25 nm-thick MgB2 thin film grown by hybrid physical-chemical deposition on SiC (0001). The...

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  3. Venkat Selvamanickam (University of Houston)
    24/07/2019, 10:30
    Invited Oral Presentation

    There is a strong interest in superconducting transmission lines that operate at microwave frequencies between milli-Kelvin and temperatures near 100 K. We are developing high-quality thin film REBCO superconductor microwave transmission lines on flexible dielectric substrates with thermal conductivity, microwave loss factor and surface resistance that meet application requirements. The high...

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