21st International Workshop on Radiation Imaging Detectors

Session

Silicon, Pixel, chair: Val O'Shea

10 Jul 2019, 11:00

70. Silicon Detectors for the LHC Phase-II Upgrade and Beyond – RD50 Status Report

Ulrich Parzefall (Albert Ludwigs Universitaet Freiburg (DE))

10/07/2019, 11:00

general

Oral

It is foreseen to significantly increase the luminosity of the LHC by upgrading towards the HL-LHC (High Luminosity LHC). Especially the Phase-II-Upgrade foreseen for installation in 2023 will mean unprecedented radiation levels, significantly beyond the limits of the silicon trackers currently employed at the LHC experiments. As a consequence, all-silicon central trackers are being studied in...

155. Characterization of irradiated p-type silicon detectors for TCAD surface radiation damage model validation

Daniele Passeri (Universita e INFN Perugia (IT))

10/07/2019, 11:15

general

Oral

The HL-LHC upgrade will impose very stringent constraints in terms of radiation resistance of solid-state detectors. In this work we address the effects of surface damage on detectors fabricated on high-resistivity p-type FZ <100> substrates by Hamamatsu Photonics (HPK) and Infineon Technologies (IFX).The devices underwent a wide set of measurements before and after X-ray irradiation with...

144. Development of the MYTHEN III microstrip detector

Marie Andrä (PSI - Paul Scherrer Institut)

10/07/2019, 11:30

general

Oral

The MYTHEN detector is a single photon counting microstrip detector with 50 µm pitch developed at the Swiss Light Source for powder diffraction experiments [1]. After more than ten years of operation of MYTHEN II, a new readout chip MYTHEN III was designed in 110 nm UMC technology to upgrade the current detector. It is designed to improve all aspects, specifically noise performance, count rate...

124. Test beam characterization of irradiated 3D pixel sensors

Andrea Garcia Alonso (Universidad de Cantabria and CSIC (ES))

10/07/2019, 11:45

general

Oral

Due to its large instantaneous luminosity, the future HL-LHC upgrade is going to set strong requirements on the radiation hardness of the CMS detector inner tracker. The 3D pixel technology, with its superior radiation hardness, complies with these extreme conditions.

A full study and characterization of pixelated 3D sensors fabricated by CNM and FBK is presented here. The sensors were bump...