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TWEPP 2019 Topical Workshop on Electronics for Particle Physics

2–6 Sept 2019
Europe/Zurich timezone

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Session

Packaging and Interconnects

4 Sept 2019, 11:30

Conveners

Packaging and Interconnects

  • Francois Vasey (CERN)

Presentation materials

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  1. 44. Prototyping of Hybrid Circuits for the CMS Phase Two Outer Tracker Upgrade at the HL-LHC
    Georges Blanchot (CERN), Nikola Rasevic
    04/09/2019, 11:30
    Packaging and Interconnects
    Oral

    High Density Interconnect hybrids are being developed for the CMS Tracker Phase Two Upgrade for the HL-LHC. These hybrids are flexible circuits with flip-chips, passives and connectors laminated to carbon fibre composite stiffeners. The wirebonding of sensors and the soldering requirements for these components requires an almost perfectly flat surface. A lamination process is proposed, focused...

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  2. 131. Power hybrids for silicon modules with macro-pixel and strip sensors for the CMS Phase-2 tracker upgrade
    Katja Klein (Rheinisch Westfaelische Tech. Hoch. (DE))
    04/09/2019, 11:55
    Packaging and Interconnects
    Oral

    The upgraded CMS tracker at the HL-LHC will feature new silicon modules with a macro-pixel sensor and a strip sensor on top of each other. The modules require three supply voltages (1.0V, 1.2V, 2.5V), which are provided in a two-stage DC-DC conversion powering scheme. Two DC-DC buck converters are supplied in parallel from the first powering stage. A four-layer flexible power hybrid based on...

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