Conveners
Packaging and Interconnects
- Francois Vasey (CERN)
High Density Interconnect hybrids are being developed for the CMS Tracker Phase Two Upgrade for the HL-LHC. These hybrids are flexible circuits with flip-chips, passives and connectors laminated to carbon fibre composite stiffeners. The wirebonding of sensors and the soldering requirements for these components requires an almost perfectly flat surface. A lamination process is proposed, focused...
The upgraded CMS tracker at the HL-LHC will feature new silicon modules with a macro-pixel sensor and a strip sensor on top of each other. The modules require three supply voltages (1.0V, 1.2V, 2.5V), which are provided in a two-stage DC-DC conversion powering scheme. Two DC-DC buck converters are supplied in parallel from the first powering stage. A four-layer flexible power hybrid based on...
