TWEPP 2019 Topical Workshop on Electronics for Particle Physics

Session

Working groups

Sep 4, 2019, 4:30 PM

Conveners

Working groups: FPGA

• Jean-Pierre Cachemiche (Centre National de la Recherche Scientifique (FR))

Working groups: MUG

• Kostas Kloukinas (CERN)

174. LASP Test Board cooling simulations - first approach

Jean-Pierre Cachemiche (Centre National de la Recherche Scientifique (FR))

9/4/19, 4:30 PM

Oral

169. Welcome

Kostas Kloukinas (CERN)

9/4/19, 4:30 PM

170. CHIPS: CERN-HEP IC design Platform and Services

Kostas Kloukinas (CERN)

9/4/19, 4:35 PM

171. EUROPRACTICE EDA Tools for the HEP Community

Dr John McLean

9/4/19, 4:55 PM

175. Thermal study and optimisation of an ATCA card for the Phase-2 Upgrade of LHC experiments

Gregory Michiel Iles (Imperial College (GB))

9/4/19, 5:00 PM

Oral

172. CERN ASIC support News & Radiation Tolerant device models for 65nm technology

Alessandro Caratelli (EPFL, CERN)

9/4/19, 5:20 PM

176. Thermal Design and Test of gFEX

Kai Chen (Brookhaven National Laboratory (US))

9/4/19, 5:30 PM

Oral

173. Library Characterization techniques

Maxime Barbe (Cadence VCAD)

9/4/19, 5:40 PM