Session

Session4

15 Dec 2019, 16:40
Sun: B1F-Meeting rooms#4-6; Mon-Wed: B2F-RAN (International Conference Center Hiroshima)

Sun: B1F-Meeting rooms#4-6; Mon-Wed: B2F-RAN

International Conference Center Hiroshima

Peace Memorial Park, Hiroshima-shi

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  1. Hiroaki Kiji
    15/12/2019, 16:40
    Applications in biology, medicine, medical equipments
    ORAL

    X-ray computed tomography (CT) is a widely used diagnostic tool. However, the exposure dose of conventional CT in a single scan is large, typically 10 mSv, and therefore, reducing the radiation dose is a problem to be solved. Furthermore, conventional CT does not have the energy information of individual X-ray photon because the read out is an integrated pulse signal. Hence, it causes the...

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  2. 15/12/2019, 17:00
    Pixel sensors for tracking
    ORAL

    Belle II experiment was successfully started. The first data for physics with full Belle II detector were taken in 2019 and 50ab$^{-1}$ data will be accumulated by 2027. A discussion of an upgrade plan for Belle II and SuperKEKB is started. The instantaneous luminosity by the upgraded SuperKEKB is 5 times larger than current design luminosity for SuperKEKB (8x10$^{35}$cm$^{-2}$s$^{-1}$) and...

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  3. Kouichi Hagino
    15/12/2019, 17:20
    Radiation damage and radiation tolerant materials
    ORAL

    We have been developing the X-ray SOI (Silicon-On-Insulator) pixel sensor named XRPIX for the future astronomical satellite FORCE. XRPIX is a monolithic active pixel sensor composed of high-resistivity Si sensor, thin SiO2 insulator and CMOS pixel circuits by utilizing the SOI technology. Since XRPIX is capable of event-driven readout, it can achieve a high timing resolution better than ∼10...

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  4. Toru Tsuboyama (KEK)
    15/12/2019, 17:40
    Pixel sensors for imaging
    ORAL

    In HSTD11, we reported a SOI pixel sensor, SOFIST Ver.4, for the International Linear collider using 3D integration technology. In SOFIST4, we had integrated preamplifier, comparator and 3-stage charge and timestamp memories all within 20 $\mu$mm $\times$ 20 $\mu$m pixel area. This chip would satisfy the requirements for the linear collider vertex detector: the low hit occupancy, low material...

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