16th (Virtual) "Trento" Workshop on Advanced Silicon Radiation Detectors

Topical Session: 3D integration technologies in radiation and optical sensors

In the last decade, vertical and 3D integration technologies have been driving important developments in CMOS microelectronics and sensing devices. They allowed an increase in the integration level of electronics components as well as the implementation of new functionalities. Nowadays, these technologies have risen to a high level of maturity and are now considered standard technologies in some fields such as CMOS image sensors. Many attempts have also been done in implementing these technologies in the production of radiation sensors or advanced optical sensors for HEP experiments.

The goal of this session is to bring together experts on 3D integration technologies (wafer-level integration, through silicon vias, back-side illumination) and detector applications (e.g. particle tracking, medical imaging) for discussions of the state of the art of such a technology, establishment of requirements of the fields and new perspectives.