Feb 16 – 18, 2021
FBK, Trento
Europe/Zurich timezone

Continuing in its tradition, the goal of the workshop is to bring together experts on sensor technology (design and processing), front-end electronics, system issues, detector applications (e.g., particle tracking, medical and biological imaging), etc. for discussions of the present state of the art, establishment of requirements of the fields  and future programs.
The workshop will consist of invited talks and contributed oral presentations, also hosting a Topical Session on 3D integration technologies.

Due to the Covid-19 pandemics, the Workshop will be virtual. 

Connections will be managed by Zoom: 


Meeting ID: 672 3954 3651
Passcode: 328261

FBK, Trento

Topical Session: 3D integration technologies in radiation and optical sensors

In the last decade, vertical and 3D integration technologies have been driving important developments in CMOS microelectronics and sensing devices. They allowed an increase in the integration level of electronics components as well as the implementation of new functionalities. Nowadays, these technologies have risen to a high level of maturity and are now considered standard technologies in some fields such as CMOS image sensors. Many attempts have also been done in implementing these technologies in the production of radiation sensors or advanced optical sensors for HEP experiments.

The goal of this session is to bring together experts on 3D integration technologies (wafer-level integration, through silicon vias, back-side illumination) and detector applications (e.g. particle tracking, medical imaging) for discussions of the state of the art of such a technology, establishment of requirements of the fields and new perspectives.