16–18 Feb 2021
FBK, Trento
Europe/Zurich timezone

Scientific Programme

  • Planar sensors

    PLA
  • 3D Sensors

    3D
  • CMOS

    CMOS
  • Electronics

    ELE
  • LGAD

    LGAD
  • Technology and Applications

    TECHAPP
  • Simulations

    SIM
  • System Issues

    SYS
  • 3D integration technologies in radiation and optical sensors

    VI

    Topical session