Conveners
Session 6: 3D Integration 2
- Giovanni Paternoster (FBK)
The material budget in the innermost tracking layers is a critical parameter that strongly influences the impact parameter resolution especially for lower momentum particles. Monolithic silicon pixel detectors can be thinned to typical thicknesses of 100 µm or less, thus providing the possibility to minimize the silicon contribution in the material budget. The MALTA monolithic silicon pixel...
The Moore’s law, which governs the development of microelectronics for 50 years, is nearly ending due do its physical limits at the 2nm or 1nm technology nodes. In order to improve the device performance and for reducing the signal latency and the power consumption, the semiconductor industry has focused its efforts for stacking wafer on wafer, die on wafer, and die on die. This paper will...
In the last decade, 3D integration technologies have been driving important developments in CMOS microelectronics like memories and CMOS image sensors. They allowed an increase in the integration level of electronics components as well as the implementation of new functionalities.
In the framework of the IPCEI project (Important Projects of Common European Interest), Fondazione Bruno Kessler...
