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16th (Virtual) "Trento" Workshop on Advanced Silicon Radiation Detectors

16–18 Feb 2021
FBK, Trento
Europe/Zurich timezone

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Session

Session 6: 3D Integration 2

VI2
17 Feb 2021, 11:20
FBK, Trento

FBK, Trento

Conveners

Session 6: 3D Integration 2

  • Giovanni Paternoster (FBK)

Presentation materials

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  1. 181. Interconnection studies for monolithic silicon pixel detector modules using the MALTA CMOS pixel chip
    Petra Riedler (CERN)
    17/02/2021, 11:20
    3D integration technologies in radiation and optical sensors
    Oral

    The material budget in the innermost tracking layers is a critical parameter that strongly influences the impact parameter resolution especially for lower momentum particles. Monolithic silicon pixel detectors can be thinned to typical thicknesses of 100 µm or less, thus providing the possibility to minimize the silicon contribution in the material budget. The MALTA monolithic silicon pixel...

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  2. 182. 3D integration in nanoelectronics: Basic technologies and applications to image sensors
    Christophe Wyon (CEA French Alternative Energies and Atomic Energy Com)
    17/02/2021, 11:45
    3D integration technologies in radiation and optical sensors
    Oral

    The Moore’s law, which governs the development of microelectronics for 50 years, is nearly ending due do its physical limits at the 2nm or 1nm technology nodes. In order to improve the device performance and for reducing the signal latency and the power consumption, the semiconductor industry has focused its efforts for stacking wafer on wafer, die on wafer, and die on die. This paper will...

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  3. 176. 3D integration technologies at FBK for Radiation and Optical Sensors
    Giovanni Paternoster (Fondazione Bruno KEssler)
    17/02/2021, 12:10
    3D integration technologies in radiation and optical sensors
    Oral

    In the last decade, 3D integration technologies have been driving important developments in CMOS microelectronics like memories and CMOS image sensors. They allowed an increase in the integration level of electronics components as well as the implementation of new functionalities.
    In the framework of the IPCEI project (Important Projects of Common European Interest), Fondazione Bruno Kessler...

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