Login

16th (Virtual) "Trento" Workshop on Advanced Silicon Radiation Detectors

16–18 Feb 2021
FBK, Trento
Europe/Zurich timezone

Support

Session

Session 5: 3D Integration 1

VI1
17 Feb 2021, 09:00
FBK, Trento

FBK, Trento

Conveners

Session 5: 3D Integration 1

  • Giovanni Paternoster (FBK)

Presentation materials

There are no materials yet.

  1. 188. Introduction
    Dr Giovanni Paternoster (FBK)
    17/02/2021, 09:00
    Oral
  2. 137. Photon/Particle to Digital Converter
    Fabrice Retiere (TRIUMF)
    17/02/2021, 09:10
    3D integration technologies in radiation and optical sensors
    Oral

    The Photon to Digital Converter configuration was introduced by the universite de Sherbrooke (EC, Canada) to label their single photon detector composed of an array of Single Photon Avalanche Diode (SPAD) array and a CMOS electronics chip assembled in 3D. In this talk we show an extension of the PDC concept to the detection of charged particles as well as single photons relying on a back-side...

    Go to contribution page
  3. 183. Advanced Electronic Packaging Technologies for Hybrid Detectors
    Thomas Fritzsch (Fraunhofer IZM)
    17/02/2021, 09:35
    3D integration technologies in radiation and optical sensors
    Oral

    Hybrid pixel detector modules are the basic building blocks of vertex detectors in HEP as well as solid state detector cameras for x-ray imaging. A pixelated sensor chip, made of silicon or III/V semiconductor, is connected to one or more electronic readout chips by thousands of electrically conductive interconnect structures.
    The talk will give an introduction in the interconnection and...

    Go to contribution page
  4. 136. Prospects for 3D integration in future pixel detectors and readout chips
    Valerio Re (Universita and INFN (IT))
    17/02/2021, 10:00
    3D integration technologies in radiation and optical sensors
    Oral

    3D integration technologies have generated a wide interest in the pixel sensors and front-end electronics communities. They have the potential to lead to the fabrication of multilayer high performance devices with no dead area, where each layer is optimized for its function (particle sensing, analog signal amplification and filtering, digital memory and readout, silicon photonics,..). Recent...

    Go to contribution page
  5. 151. Pixel detector hybridization and integration with Anisotropic Conductive Films
    Mateus Vicente Barreto Pinto (CERN)
    17/02/2021, 10:25
    3D integration technologies in radiation and optical sensors
    Oral

    An alternative pixel-detector hybridization technology based on Anisotropic Conductive Films (ACF) is under development to replace the conventional fine-pitch flip-chip bump bonding. The new process takes advantage of the recent progress in industrial applications of ACF and is suitable for time- and cost-effective in-house processing of single devices. This new bonding technique developed can...

    Go to contribution page
Building timetable...