Abstract:
We are performing R&D for pixels for the LHCb Vertex Locator Upgrade. Initial investigations have focused on a derivative of the Medipix/Timepix family of chips for the front-end electronics. During the summer of 2009, a test beam run was done to demonstrate the suitability of Timepix, when bump bonded to a silicon pixel sensor. I will present preliminary analysis results including cluster characteristics, charge measurement (Landau distribution), resolution performance, bias voltage dependence, and reconstructed pulse shape. A tracking resolution of about 5 microns has been achieved for angled tracks indicating a very satisfactory resolution performance.