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TWEPP 2011 Topical Workshop on Electronics for Particle Physics

26–30 Sept 2011
Vienna, Austria
Europe/Zurich timezone

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Session

A5a - Packaging and Interconnects

A5a
29 Sept 2011, 09:50
Vienna, Austria

Vienna, Austria

<font face="Verdana" size="2"><b>Vienna University of Technology</b> Department of Electrical Engineering Gusshausstraße 27-29 1040 Vienna, Austria

Conveners

A5a - Packaging and Interconnects

  • Jorgen Christiansen (CERN)

Presentation materials

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  1. 145. Microfluidic cooling for detectors and electronics
    Paolo Petagna (CERN)
    29/09/2011, 09:50
    Packaging
    Oral
    Micro-channel cooling is gaining considerable attention as an alternative technique for cooling of high energy physics detectors and front-end electronics. We are evaluating this technology for future tracking devices where material budget limitations are a major concern. Micro channel cooling is currently under investigation as an option for the cooling of the NA62 Gigatracker silicon pixel...
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  2. 128. Progress on a Si-W ECAL Detection and Readout Interconnects
    Mr Michael Woods (University of California Davis)
    29/09/2011, 10:15
    Packaging
    Oral
    The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve bonding technologies for the interconnects, especially silicon detector wafer to a flex-cable readout bus attachments. We review the interconnect technologies involved, including oxidation...
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