A5b - Packaging and Interconnects - Radiation tolerant components and systems
- Jorgen Christiansen (CERN)
Dr Anna Macchiolo (Max-Planck-Institut fuer Physik)
9/29/11, 11:00 AM
We will report on the characterization of pixel modules composed of 75 microns thick n-in-p sensors and ATLAS FE-I3 chips, interconnected via the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is employed as an alternative to the bump-bonding process. These modules have been designed as a demonstration of a very compact detector to be employed...
Dr Sandro Bonacini (CERN)
9/29/11, 11:25 AM
The radiation characteristics with respect to Total Ionizing Dose (TID) of a 65 nm CMOS technology has been investigated. Single transistor structures of a variety of dimensions and several basic circuits were designed and fabricated. The circuits include a 64-kbit shift-register, a 9-kbit SRAM, a ring-oscillator, a low noise preamplifier, a low-power discriminator and two 6-bit DACs with...
Dr Takeo Higuchi (KEK)
9/29/11, 11:50 AM
Readout and digitization electronics of upgraded B-factory detector Belle II will be located at the detector side to reduce number of analog cables. The digitized signals are transmitted out over optical serial links. The on-detector electronics is expected to suffer about 10¹² neutrons per year with kinetic energy peaking around 5 MeV. In our studies bombarding a prototype on-detector...
Ms Evangelia GOUSIOU (CERN)
9/29/11, 12:15 PM
WorldFIP is a deterministic fieldbus used in the LHC for the communication with a variety of systems. There are more than 10.000 WorldFIP agents installed all around the LHC tunnel and exposed to a complex radiation field. A new customized version of WorldFIP agents, the nanoFIP, housed in an Actel ProASIC3 FPGA, has been developed at CERN in cooperation with the industry. The paper describes...