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TWEPP 2011 Topical Workshop on Electronics for Particle Physics

26–30 Sept 2011
Vienna, Austria
Europe/Zurich timezone

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Plenary 4 - 3D integration of pixel detectors at VTT

P4
28 Sept 2011, 14:00
Vienna, Austria

Vienna, Austria

<font face="Verdana" size="2"><b>Vienna University of Technology</b> Department of Electrical Engineering Gusshausstraße 27-29 1040 Vienna, Austria

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  1. 163. 3D integration of pixel detectors at VTT
    Sami Vaehaenen
    28/09/2011, 14:00
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    Oral
    Vertical (3D) integration using Through Silicon Vias (TSV) is gaining lot of attention within electronics industry. 3D integrated structures should enhance electrical performance of electronic devices, boost up device miniaturization, and enable new designs and stacks of device layers made with heterogeneous technologies. For pixel detectors, 3D integration using TSVs in combination with...
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