TWEPP 2011 Topical Workshop on Electronics for Particle Physics

Session

Plenary 4 - 3D integration of pixel detectors at VTT

P4

28 Sept 2011, 14:00

Vienna, Austria

163. 3D integration of pixel detectors at VTT

Sami Vaehaenen

28/09/2011, 14:00

Packaging

Oral

Vertical (3D) integration using Through Silicon Vias (TSV) is gaining lot of attention within electronics industry. 3D integrated structures should enhance electrical performance of electronic devices, boost up device miniaturization, and enable new designs and stacks of device layers made with heterogeneous technologies. For pixel detectors, 3D integration using TSVs in combination with...