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TWEPP 2011 Topical Workshop on Electronics for Particle Physics

26–30 Sept 2011
Vienna, Austria
Europe/Zurich timezone

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Session

TUTORIAL - Advanced Packaging (Part 2)

TUT
30 Sept 2011, 16:10
Vienna, Austria

Vienna, Austria

<font face="Verdana" size="2"><b>Vienna University of Technology</b> Department of Electrical Engineering Gusshausstraße 27-29 1040 Vienna, Austria

Conveners

TUTORIAL - Advanced Packaging (Part 2)

  • Jorgen Christiansen (CERN)

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  1. 174. Advanced Packaging (Part 2)
    Mr VAL
    30/09/2011, 16:10
    Oral
    • Requirements to and technologies for IC packaging. • Overview of different packaging technologies and their specific applications. • Packaging for high reliability applications. • Pitfalls and challenges in IC Packaging. • Advanced 3D packaging (chip on chip / die on die / etc.).
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