TWEPP 2011 Topical Workshop on Electronics for Particle Physics

Session

TUTORIAL - Advanced Packaging (Part 2)

TUT

Sep 30, 2011, 4:10 PM

Vienna, Austria

Conveners

TUTORIAL - Advanced Packaging (Part 2)

• Jorgen Christiansen (CERN)

174. Advanced Packaging (Part 2)

Mr VAL

9/30/11, 4:10 PM

Oral

• Requirements to and technologies for IC packaging. • Overview of different packaging technologies and their specific applications. • Packaging for high reliability applications. • Pitfalls and challenges in IC Packaging. • Advanced 3D packaging (chip on chip / die on die / etc.).