22–26 Jul 2024
CICG - GENEVA, Switzerland
Europe/Zurich timezone

Study on the performance of liquid helium re-liquefier for superconducting chip test

25 Jul 2024, 14:00
2h
Poster area

Poster area

Poster Presentation (120m) ICEC 04: Cryogenic applications: cryocoolers Thu-Po-3.5

Speaker

Guopeng Wang (Technical Institute of Physics and Chemistry, CAS)

Description

A liquid helium re-liquefier system has been designed for superconducting chip test. The cold source of the system is a PT420 GM type Pulse tube cryocooler. On this base, the precooling structure and recondensation structure has been designed. Besides, composite magnetic shielding structure was used to ensure the chip working in an extremely low magnetic environment. With a special designed mechanical interface and PID control system, the chip could be replaced when the cryocooler is on. Experiment shows that the cooling time of the system is about 8h, and the cooling capacity is 1.15W, which could ensure the working of superconducting chip with hundreds of channels. Residual magnetism of the working chamber is below 5nT. Automatic control module could ensure the system working without people. In order to extend the holding time when unexpected power outage occurred, a special cooling capacity recovered structure has been added to the system to utilize the cooling capacity of the cold helium gas.

Submitters Country China

Primary author

Guopeng Wang (Technical Institute of Physics and Chemistry, CAS)

Co-authors

Lingjiao Wei (中国科学院理化技术研究所) Jianguo Li (Technical Institute of Physics and Chemistry, CAS) Yanjie Liu (Technical Institute of Physics and Chemistry, Chinese Academy of Science) Guotong Hong (Technical Institute of Physics and Chemistry, Chinese Academy of Sciences) Ruixin li (Technical Institute of Physics and Chemistry, CAS) Changzhen Shi (Technical Institute of Physics and Chemistry, CAS)

Presentation materials