Description
AFTER DATA TRANSMISSION, THE NEXT CHALLENGING STEP IS ON HIGH PERFORMANCE COMPUTING, HPC.
THIS SESSION TACKLES THE NOVEL DEVELOPMENTS/ADVANCES ON BOTH HARDWARE & SOFTWARE.
The cross-disciplinary and worldwide facets of this field will be highlighted by experts and key projects from Europe (EuroHPC-JU Enterprise), Asia (Tokyo University) and USA (Keynote talk). Some of them will also organized hands-on Labs (e.g. Tokyo University representatives).
With staff experience averaging more than 20 years, our seasoned team of design engineers and manufacturing professionals have solid expertise in high-density, low-power products. They work in deep submicron nodes with a keen eye for cost-size-weight reduction and design sustainability. They have created sensors, FPGAs, SerDes, memory chips (DRAM, MRAM, and RRAM), ASICs, AI systems, and many...
Lecturer: KENGO NAKAJIMA, Professor in the Supercomputing Research Division of the Information Technology Center at the University of Tokyo since 2008. Prior to joining the University of Tokyo in 2004, he spent 19 years in industry.
Also a deputy director of RIKEN R-CCS (Center for Computational Science) since 2018.
His research interest covers computational mechanics, computational fluid...
