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TWEPP 2013 - Topical Workshop on Electronics for Particle Physics

23–27 Sept 2013
Perugia, IT
Europe/Zurich timezone

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Session

TOPICAL (Packaging & High Density Hybrids)

27 Sept 2013, 09:45
Perugia, IT

Perugia, IT

<font face="Verdana" size="2.5">Congress center Giò Via R. D'Andreotto, 19 06124 Perugia (PG) Italy

Conveners

TOPICAL (Packaging & High Density Hybrids): First Part

  • Ken Wyllie (CERN)

TOPICAL (Packaging & High Density Hybrids): Second Part

  • Ken Wyllie (CERN)

Presentation materials

There are no materials yet.

  1. 204. Microfabricated silicon on-detector cooling systems
    Alessandro Mapelli (CERN)
    27/09/2013, 09:45
    Oral
    Microfabrication technologies are being investigated by the PH/DT group at CERN for optimized, localized on-detector cooling solutions for silicon tracking systems. Silicon microchannel cooling has been selected for the active thermal management of the NA62 GTK pixel detectors. 130 µm thick silicon plates with embedded microchannels, in which the radiation hard liquid C6F14 flows, are...
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  2. 149. Hybrid circuit prototypes for the CMS Tracker upgrade front-end electronics
    Georges Blanchot (CERN)
    27/09/2013, 10:10
    Oral
    New high-density interconnect hybrid circuits are under development for the CMS tracker modules at the HL-LHC. These hybrids will provide module connectivity between flip-chip front-end ASICs, strip sensors and a service board for the data transmission and powering. Rigid organic based substrate prototypes and also a flexible hybrid design have been built, containing up to eight front-end flip...
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  3. 178. The Front-End Hybrid for the ATLAS HL-LHC Silicon Strip Tracker
    Kambiz Mahboubi (Physikalisches Institut, Universitaet Freiburg)
    27/09/2013, 11:05
    Oral
    For the HL-LHC, ATLAS will install a new all-silicon tracking system. The strip part will comprise five barrel layers and seven end caps on each side. The detectors will be connected to highly-integrated low-mass front-end electronic hybrids with custom-made ASICs in 130nm technology. The hybrids are flexible PCB four-layer copper polyimide constructions. They are designed and populated at the...
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  4. 9. Ultra-thin packaging technologies for CMOS pixel sensors: embedding in kapton foils
    Wojciech Dulinski (Institut Pluridisciplinaire Hubert Curien (FR))
    27/09/2013, 11:30
    Oral
    Monolithic CMOS Pixels (MAPS) integrate on the same silicon substrate the radiation sensor element with the processing electronics. Their thickness can be very small: typically less than 50 µm. This allows for very small material budget, if not spoiled by other mechanics elements. In order to demonstrate feasibility of large area, ultra-light sensor ladders (< 0.1% radiation length) based on...
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