Conveners
TOPICAL (Packaging & High Density Hybrids): First Part
- Ken Wyllie (CERN)
TOPICAL (Packaging & High Density Hybrids): Second Part
- Ken Wyllie (CERN)
Alessandro Mapelli
(CERN)
27/09/2013, 09:45
Oral
Microfabrication technologies are being investigated by the PH/DT group at CERN for optimized, localized on-detector cooling solutions for silicon tracking systems.
Silicon microchannel cooling has been selected for the active thermal management of the NA62 GTK pixel detectors. 130 µm thick silicon plates with embedded microchannels, in which the radiation hard liquid C6F14 flows, are...
Georges Blanchot
(CERN)
27/09/2013, 10:10
Oral
New high-density interconnect hybrid circuits are under development for the CMS tracker modules at the HL-LHC. These hybrids will provide module connectivity between flip-chip front-end ASICs, strip sensors and a service board for the data transmission and powering. Rigid organic based substrate prototypes and also a flexible hybrid design have been built, containing up to eight front-end flip...
Kambiz Mahboubi
(Physikalisches Institut, Universitaet Freiburg)
27/09/2013, 11:05
Oral
For the HL-LHC, ATLAS will install a new all-silicon tracking system. The strip part will comprise five barrel layers and seven end caps on each side. The detectors will be connected to highly-integrated low-mass front-end electronic hybrids with custom-made ASICs in 130nm technology. The hybrids are flexible PCB four-layer copper polyimide constructions. They are designed and populated at the...
Wojciech Dulinski
(Institut Pluridisciplinaire Hubert Curien (FR))
27/09/2013, 11:30
Oral
Monolithic CMOS Pixels (MAPS) integrate on the same silicon substrate the radiation sensor element with the processing electronics.
Their thickness can be very small: typically less than 50 µm. This allows for very small material budget, if not spoiled by other mechanics elements. In order to demonstrate feasibility of large area, ultra-light sensor ladders (< 0.1% radiation length) based on...
