Conveners
Session 2 - Detector Characterization
- Ulrich Parzefall (Albert-Ludwigs-Universitaet Freiburg (DE))
Christian Scharf
(Hamburg University (DE))
11/06/2014, 14:00
Simulations of silicon sensors and extraction of parameters from (edge-)TCT measurements rely on the knowledge of a number of material parameters. One of them is the drift velocity for electrons and holes as function of electric field and temperature in high-purity silicon. So far the information on drift velocities for <100> silicon is quite limited. Therefore, <111> results are typically...
Christian Gallrapp
(CERN)
11/06/2014, 14:20
Setups based on the transient current technique using pulsed LASERs with 660nm and 1064nm wavelength were built at the CERN SSD Lab.
Microsecond LASER pulses are used in the I-DLTS setup to investigate charge carrier detrapping on irradiated silicon sensors. First measurement results from a set of proton irradiated silicon diodes exposed to red laser pulses of 1us to 5us are presented....
Vladimir Cindro
(Jozef Stefan Institute (SI))
11/06/2014, 14:40
CCE efficiencies of two detector batches were measured before and after irradiations with neutrons and protons to fluences up to 5 10**15 cm-2. Annealing was performed at 60 C. Edge TCT measurements were used to probe the drift velocity distribution in the detector volume.
Sven Wonsak
(University of Liverpool (GB))
11/06/2014, 15:00
To investigate the current dependence of irradiated silicon strip detectors, ATLAS07 and Micron sensors were irradiated at Birmingham and Ljubljana with doses up to 2e16 neq/cm$^2$. IV measurements were performed at different temperatures which allow the calculation of the effective gap energy Eg (IV scaling) and the current related damage rate $\alpha$.
TCT and edge TCT (Transient Current...
3.
Heavily irradiated thin n-in-p planar pixel sensors and status of the new common RD50 productions
Stefano Terzo
(Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)
11/06/2014, 15:20
N-in-p planar pixel sensors with an active thickness of 200 μm produced at CiS, and 100-200 μm thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips and irradiated in Ljubljana, Los Alamos and KIT up to a fluence of 1.4×10^{16} n_{eq}/cm^2.
Thin sensors are designed to ensure radiation hardness at high fluences, while...