TWEPP 2017 Topical Workshop on Electronics for Particle Physics

Session

Packaging and Interconnects

A

14 Sept 2017, 14:50

Conveners

Packaging and Interconnects

• Magnus Hansen (CERN)

15. Manufacturing Experience and Test Results of the PS Prototype Flexible Hybrid Circuit for the CMS Tracker Upgrade

Mark Istvan Kovacs (CERN)

14/09/2017, 14:50

Packaging and Interconnects

Oral

The CMS Tracker Phase Two Upgrade for HL-LHC requires High Density Interconnect (HDI) flexible hybrid circuits to build modules with low mass and high granularity. The hybrids are carbon fibre reinforced flexible circuits with flip-chips and passives. Three different manufacturers produced prototype hybrids for the Pixel-Strip type modules. The first part of the presentation will focus on the...