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TWEPP 2017 Topical Workshop on Electronics for Particle Physics

11–15 Sept 2017
US/Pacific timezone

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Session

Packaging and Interconnects

A
14 Sept 2017, 14:50

Conveners

Packaging and Interconnects

  • Magnus Hansen (CERN)

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  1. 15. Manufacturing Experience and Test Results of the PS Prototype Flexible Hybrid Circuit for the CMS Tracker Upgrade
    Mark Istvan Kovacs (CERN)
    14/09/2017, 14:50
    Packaging and Interconnects
    Oral

    The CMS Tracker Phase Two Upgrade for HL-LHC requires High Density Interconnect (HDI) flexible hybrid circuits to build modules with low mass and high granularity. The hybrids are carbon fibre reinforced flexible circuits with flip-chips and passives. Three different manufacturers produced prototype hybrids for the Pixel-Strip type modules. The first part of the presentation will focus on the...

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