Mani Tripathi
(Department of Physics-University of California (UCD)-Unknown)
04/02/2010, 08:30
Development of specific components, for example low mass interposers
Oral presentation
HEP detectors are continually advancing towards higher segmentation of elements and higher complexity in assembly architectures. The task of interconnecting detector elements with readout electronics and with readout buses for such detectors poses new challenges and opportunities. We will address progress on several fronts: gold stud bonding, anisotropic conducting films, conductive epoxy...
Prof.
James Alexander
(Cornell University)
04/02/2010, 08:55
Development of specific components, for example low mass interposers
Oral presentation
We report on fabrication of prototype silicon interposers for coupling pixel detectors in high energy physics experiments. The interposers feature a high density of conductive through-vias with additional mass reduction achieved by etching large voids in the silicon where possible. We report results of electrical and mechanical evaluations of the devices.
Maurice Garcia-Sciveres
(LBNL)
04/02/2010, 09:20
Development of specific components, for example low mass interposers
Oral presentation
We present prototype results for a new wafer integration component called a low mass interposer (LMI). The LMI prototype is an assembly of silicon and carbon foam resulting in a composite 4 inch wafer of 4 mm thickness and average density 10% that of silicon. Rows of vertical copper contacts traverse the bulk on 4mm pitch. Each row consists of identical contacts on 10 micron pitch. This...
