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CEC-ICMC 2019 - Abstracts, Timetable and Presentations

21–25 Jul 2019
Connecticut Convention Center, Level 6
US/Eastern timezone

Conference Management

Session

M4Or1B - Microelectronics II

M4Or1B
25 Jul 2019, 09:30
Level 6, Room 14

Level 6, Room 14

Conveners

M4Or1B - Microelectronics II

  • Ke Chen (Temple University)
  • Michael Hamilton (Auburn University)

Presentation materials

There are no materials yet.

  1. 1189. M4Or1B-01 [Invited]: Improved RF Receiver Performance and Efficiency with Analog Preprocessing: a Cryogenic Engineering Opportunity
    Anna Leese de Escobar (NIWC Pacific)
    25/07/2019, 09:30
    Invited Oral Presentation

    The trend to all digital processing and software defined radio receivers was driven by a lack of flexibility, reliability and loss in the analog processing block of receivers. While the flexibility of software defined radio is clear, cryogenic temperatures offer an opportunity to exploit lower thermal noise in standard components and increase overall system efficiency and performance by...

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  2. 811. M4Or1B-02 [Invited]: Microwave Antenna Properties of an Optically Triggered Superconducting Ring
    Dr Thomas Bullard (UES Inc.)
    25/07/2019, 10:00
    Invited Oral Presentation

    It is well established that superconducting materials will emit microwave/terahertz radiation when illuminated with a femtosecond infrared laser pulse. Typically this phenomena is examined by illuminating a voltage biased superconducting thin film bridge. In this investigation an inductively charged superconducting thin film ring is considered. We believe the configuration lends itself to a...

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  3. 1058. M4Or1B-03 [Invited]: High Throughput and Variable Temperature Test and Evaluation of Superconductor Integrated Circuits using Integrated Cryogenic Electronics Testbed
    Mr Anubhav Sahu (HYPRES)
    25/07/2019, 10:30
    Invited Oral Presentation

    As superconductor digital integrated circuits (ICs) mature to productization, they require rapid evaluation of multiple copies to obtain statistical operational data. These data are used for assessing model-to-hardware correlation and facilitate iterative IC design development. The Integrated Cryogenic Electronics Testbed (ICE-T) is a cryogen-free test platform, which can test multiple chips...

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