TWEPP 2019 Topical Workshop on Electronics for Particle Physics

Session

Invited

2 Sept 2019, 15:25

177. Radiation Physics Lab: A TID test installation at USC

Faustino Gomez (Universidad de Santiago de Compostela)

02/09/2019, 15:25

Oral

Radiation Physics Laboratory (http://www.usc.es/rpl) is an accredited Secondary Standard Dosimetry Lab in the University of Santiago with more than 10 years of experience on photon and electron TID experiments. Currently the laboratory has a high dose rate 60-Co unit together with an electron linal able to produce 6 MV and 15 MV photon beam qualities and electron beams with 6, 9, 12, 16 and 20...

178. Focal plane processing in standard CMOS technologies

Paula López Martínez (University of Santiago de Compostela (ES))

02/09/2019, 16:05

Oral

The new paradigm of Analog to Information Conversion (AIC) aims at extracting information from the environment rather than simply massive amounts of raw data. Focal plane processing is a way of doing so by means of processing the sensed data at the acquisition stage, efficiently reducing bandwidth and power consumption. The use of standard CMOS technologies favours the development of low cost...

179. Time Resolution of Large Area Low Light Level Sensors

David Gascon (University of Barcelona (ES))

02/09/2019, 17:05

Oral

Large area photo-detectors with time resolution of the order of 10 ps for low lights levels, down to the single photon, would bring a revolution in many fields. In medical imaging would enable real time PET, in LIDAR would make possible achieving millimetric spatial resolution requiring no averaging and would have a strong impact in other fields as fluorescence imaging and, of course, in high...

163. Future Prospects of Particle Physics

Albert De Roeck (CERN)

03/09/2019, 10:45

Oral

An overview will be given where we stand with the fundamental questions in particle physics today, and how we
plan to answer these in future with new projects world-wide, either already planned ones or those still under discussion.
The ongoing European Particle Physics Strategy Update process is currently evaluating possible future programs and their physics merits.
This general seminar...

166. Using advanced SoCs at the CERN experiments and accelerator

Marc Dobson (CERN)

03/09/2019, 15:45

Oral

Recent hardware developments in the experiments and the accelerators, especially for the detector readout electronics for the High-Luminosity LHC, are using FPGAs with embedded processors (SoCs).
This is very popular with HW developers due to the close integration between the computing element running a unix operating system and the programmable logic part of the FPGA. For the HL-LHC, there...

164. High-speed design : how to successfully address the high speed challenges : 25Gbps and over

Jean-Michel CAPITAN (Hardware Expert, CCES)

04/09/2019, 10:45

Oral

Today communication protocols (32Gbps PCIE Gen5, 112Gbs PAM4, ...) and FPGAs transceivers speeds are pushing
designer to hardware designs constraints, PCB material choice and layout constraints that where almost never considered years ago.
This presentation is an extract of a CCES technical training, and its purpose is to cover some of the theorical aspects of "high speed",
as well as some...

167. Designing advanced SoCs in technologies down to 28nm CMOS: challenges and solutions.

Sebastien Caussette (Cadence)

04/09/2019, 15:45

Oral

Sub 65-nm technologies can offer to engineers huge advantages for the design of high-density and low power circuits and for the integration of high complexity System-on-Chips. Transistors and gates are almost free for the creative designer, but yet their correct integration requires an exponentially increasing investment in tools and training, and a totally new approach to verification, all...

180. The lonely perpetrator in the DCDC FEAST2 case: how an individual transistor threatened the operation of the CMS pixel detector

Federico Faccio (CERN)

05/09/2019, 15:45

Oral

The failure of a first DCDC converter in the power distribution network of the CMS pixel detector system on October 5th, 2017, might have been due to a single failure and did not raise particular concern. However, it was soon followed by a steady rate of failures of DCDCs in random positions in the detector. Projections of this rate to the future led to an ominous scenario where, without...

168. Particle detection and imaging using the Medipix and Timepix ASICS: design, challenges and applications

Michael Campbell (CERN)

06/09/2019, 10:45

Oral

September 2019 marks 20 years since the signature of the Medipix2 Collaboration agreement. Since then 3 generations of pixel detector readout chips have been or are being developed: Medipix2 and Timepix (with recently the addition of Timepix2), Medipix3 and Timepix3 and finally Medipix4 and Timepix4. The Medipix chips have sought to provide high-rate spectroscopic photon counting with...

162. Technology development of CMOS Image sensors

Andrea Del Monte (LFoundry)

Oral

After a basic review of the working principles of CMOS image sensor (pinned photodiode device), the main technologies and process modules (such as Back-Side Illumination, integrated lightguides and anti-reflective coatings, buried light shields, hybrid bonding) used in the manufacturing of CMOS Image Sensors (CIS) will be described, focusing on their correlation with the performance of pixel...