A Concept for Spatially and Timely Correlated Single Event Effects Detection in Semiconductors Using Timepix3 Pixel Detectors

Dec 14, 2019, 3:06 PM
POSTER - Sun: B1F-Meeting room#3, B2F-RAN1/2; Mon-Wed: B1F Meeting rooms #5-6 (International Conference Center Hiroshima)

POSTER - Sun: B1F-Meeting room#3, B2F-RAN1/2; Mon-Wed: B1F Meeting rooms #5-6

International Conference Center Hiroshima

Peace Memorial Park, Hiroshima-shi
POSTER Radiation damage and radiation tolerant materials POSTER


Dr Jan Broulim (University of West Bohemia)


Knowing the reliability of electronic systems operating under extreme conditions is crucial, especially in nuclear and space applications. In such environment, the proper functionality of electronic systems is endangered because of Single Event Effect (SEE) occurrence. In our work, we present an experimental setup for measuring fault detection correlated with events occuring in silicon detectors. A replaceable Device Under Test (DUT) is connected to the holder board via soldering pads. I/O signals are processed in a tester, FPGA based board, synchronized with two Timepix 3 readouts.

In this work, we present an electronic system for measuring SEEs timely and spatially correlated with Timepix detectors. The Timepix detector is a semiconductor pixel detector, which contains 256 x 256 pixels. It provides energy or time information for each hit pixel. Our experimental setup consists of FPGA based board synchronized Timepix3 readout and a Device Under Test (DUT).

Submission declaration Original and unpublished

Primary authors

Dr Jan Broulim (University of West Bohemia) Jan Zich Michael Holik Pavel Broulim (University of West Bohemia) Petr Burian Vjaceslav Georgiev Dr Vladimir Pavlicek (University of West Bohemia)

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