12th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD12) at Hiroshima, Japan

A Concept for Spatially and Timely Correlated Single Event Effects Detection in Semiconductors Using Timepix3 Pixel Detectors

14 Dec 2019, 15:06

1m

POSTER - Sun: B1F-Meeting room#3, B2F-RAN1/2; Mon-Wed: B1F Meeting rooms #5-6 (International Conference Center Hiroshima)

POSTER Radiation damage and radiation tolerant materials POSTER

Speaker

Dr Jan Broulim (University of West Bohemia)

Description

Knowing the reliability of electronic systems operating under extreme conditions is crucial, especially in nuclear and space applications. In such environment, the proper functionality of electronic systems is endangered because of Single Event Effect (SEE) occurrence. In our work, we present an experimental setup for measuring fault detection correlated with events occuring in silicon detectors. A replaceable Device Under Test (DUT) is connected to the holder board via soldering pads. I/O signals are processed in a tester, FPGA based board, synchronized with two Timepix 3 readouts.

In this work, we present an electronic system for measuring SEEs timely and spatially correlated with Timepix detectors. The Timepix detector is a semiconductor pixel detector, which contains 256 x 256 pixels. It provides energy or time information for each hit pixel. Our experimental setup consists of FPGA based board synchronized Timepix3 readout and a Device Under Test (DUT).