Scintillation detectors are widely used in various imaging techniques in the fields of medicine, astronomy, and environment. In general, large-area and fine-pixel scintillation arrays are needed to improve the sensitivity and image quality of detectors. However, a large scintillation array requires a huge number of read-out channels, which makes the detector system complex and expensive. The...
In medical imaging, precise and reliable images are very important. However, the quality of images is sometimes limited because of low-event statistics owing to the lack of sensitivity of detectors in radiology. However, long exposure to radiation and a long inspection duration become a burden for the patients. In this paper, we propose a method for generating/predicting high quality images of...
Scintillator and scintillator array detectors have been applied as gamma-ray imaging sensors in many fields, including high-energy physics, medical imaging, astrophysics, and homeland security. One of the most recent trends in gamma-ray imaging is the Compton camera. The Compton camera is based on active-matrix pixels composed of either (1) semiconductor detectors or (2) scintillators....
The new pocket size read-out interface device dedicated for silicon photomultipliers (SiPM) has been designed and developed. While it was designed as a miniaturized and low power device it still provides a wide spectrum of functionality necessary for measurements and testing of SiPMs and SiPM based detectors. Full signal processing has been integrated within the device involving variable gain...
HEPS-BPIX3 is the third prototype of single-photon counting pixel detector with 1.4 million pixels developed for applications of synchrotron light sources. It follows the first prototype, HEPS-BPIX, with a pixel size of 150 µm x 150 µm and frame rate up to 1.2 kHz at 20-bit dynamic range. To reduce the insensitive gap between modules, we start to upgrade it with the through silicon via (TSV)...
In this study, a silicon-on-insulator (SOI) pixel detector was used to evaluate the fatigue damage of railway rails. For this purpose, the SOI pixel detector detected diffracted CrKα X-rays from a sample of a rail. Part of the Debye ring generated by the diffracted X-ray beams was obtained and was then analysed by using the principle of the X-ray stress analysis method. The rail from which the...
Keywords: SOI monolithic pixel, SOFIST, 3D
We are developing a monolithic pixel sensor SOFIST using a 0.2 um FD-SOI (Fully depleted silicon-on-insulator) technology for the ILC vertex detector. Adopted is a double SOI wafer manufacturing technology that two buried oxide layers are formed on a high resistive sensor wafer and MOSFETs are formed thereon. Advantages such as low noise due to...
Residual stress is an important factor to evaluate and control the quality of metal materials for industrial products. The residual stress measurement using X-rays is one of the most effective ways to evaluate residual stress without destruction. In this measurement, a Debye-ring that is formed by diffraction of X-ray beams on the surface of polycrystalline metal is used. The effects of...
Sub-MeV gamma rays are produced by nucleosynthesis processes caused by high energy phenomena in the universe such as supernova explosions. As the details of such nucleosynthesis processes can be inferred from their spectral line features, improved spectral performance in the sub-MeV range is vitally important. However, observations in this energy band have lagged by some decades because of...
We have developed a neutron imaging device based on the INTPIX4 SOI pixelated silicon sensors. INTPIX4 is an integration-type sensor with 17 $\mu$m x 17 $\mu$m pixel circuit array on a SOI wafer, in which correlated double sampling (CDS) circuits and storage capacitors are implemented for synchronized operation with outer trigger timings. The number of pixels is 832 x 512 and effective area is...
In recent years, the aging of metal structures has become a problem in various social infrastructures that form the basis of livelihood and production. Therefore, various inspections are performed on metal structures to evaluate their degree of fatigue and the remaining life. Residual stress is one of the indicators for evaluating the soundness of metal structures, and many evaluation...
We have been developing X-ray Silicon-On-Insulator (SOI) pixel sensors, called "XRPIX" for the next generation X-ray astronomy satellite "FORCE" (Tsuru et al. 2018, Proc. of SPIE 10709, 107090H). XRPIX has the event trigger output function which achieves a time resolution of 10 $\mu$s. This time resolution is higher by an order of five than that of X-ray CCDs, used as the main detectors in the...
Future X-ray astronomical satellite missions will require a new type of detector that offers a lower non-X-ray background (NXB) rate. To realize this, we have been developing a series of monolithic active pixel detectors, named “XRPIX,” based on silicon-on-insulator (SOI) complementary metal-oxide-semiconductor technology. The XRPIX series offers higher coincidence time resolution (< 10 μs)...
An all-sky survey of X-ray transient objects in the soft X-ray band is essential to discover mysterious electromagnetic counterparts of gravitational-wave sources, and observe high-redshift objects to probe unexplored physical conditions in the early universe. HiZ-GUNDAM is a future satellite mission to realize this in the soft X-ray band (0.4–4 keV). The X-ray detector of HiZ-GUNDAM has Si...
The last couple of years have seen a large learning curve in Depleted Monolithic Active Pixel Sensors (DMAPS) fabricated with a process modification for increasing radiation tolerance. Two large scale prototypes: Monopix with a column drain synchronous readout, and Malta with a novel asynchronous architecture have been fully tested and characterised. This experience has shown that certain...
Digital X-ray imaging systems have been substituting analog X-ray imaging systems with conventional X-ray film-screen for radiography applications. Currently, the large-area flat panel imagers with TFT (thin film transistor) and CMOS (complementary metal-oxide semiconductor) process have been widely used in various X-ray imaging applications. Indirect detection type for digital X-ray imaging...
In the previous Hiroshima symposium (HSTD11), we presented a detection concept of a pixelated silicon sensor integrated with junction field effect transistor (JFET), fabrication process flow charts of it, and simulation studies based on this detector concept. The JFET is designed to have the cylindrical structure and is used as a switch to readout charges accumulated in the pixelated sensor....
This work develops a 3-Dimensional trench electrode (3D-Trench-Electrode) Si micro-nano detector with micron separation in electrodes and sub-micron (nano) electrode sizes for applications in extremely harsh radiation environments. Such extreme environments include CERN’s Large Hadron Collide (LHC), nuclear explosion or radiation sites, and in deep space. The target total radiation fluence...
In this work, a novel three-dimensional (3D) structure of silicon detector: 3D-Compound-Shell-Electrode detector (3DCSED), based on the 3D-Trench-Electrode detector and 3D-Open-Shell-Electrode detector (3DOSED), is proposed. In a 3DCSED, an open trench electrode will be etched about 10% of the detector thickness from the bottom side of the detector to meet the close trench electrode etched...
The Circular Electron Positron Collider (CEPC) has been proposed in China as a Higgs and/or Z factory. Pixel sensors with high spatial resolution, low material budget and low power consumption are required for the inner most layer of vertex detector. As a part of R&D activities, a prototype of SOI pixel sensor with a novel Pinned Depleted Diode (PDD) design has been developed accordingly, to...
The proposed CEPC (Circular Electron Positron Collider) will offer the measurements of the Higgs properties with a new level of precision. The precise determination of the charged particle tracks and reconstruction of the primary and displaced decay vertices, impose stringent requirements on the CEPC vertex detector, which somehow incompatible with each other, such as high spatial resolution...
The CEPC vertex detector system expects low resolution, low material, fast readout, and low power. Monolithic CMOS Pixel Sensors (CPS) are preferred. In the past, several chips have been developed for studying the sensing diode and the readout architectures. This work aims to realize a fully functional peripheral readout logic design for CPS.
In the CEPC experiments, the bunch spacings and...
The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of material budget, spatial resolution, readout speed, and power consumption. CMOS Pixel Sensor (CPS), as one of the promising candidate technologies, has been studying within the CEPC vertex detector R&D activities since 2015. According to the latest collider design and study on the...
In the ATTRACT project FASTPIX we investigate monolithic pixel sensors with small collection electrodes in CMOS technologies for fast signal collection and precise timing in the sub-nanosecond range.
Deep submicron CMOS technologies allow tiny, sub-femtofarad collection electrodes, and large signal-to-noise ratios, essential for very precise timing. However, complex in-pixel circuits...
A sensor chip for a capacitively coupled particle detector (CCPD53) has been designed and produced in a 180 nm high voltage CMOS (HVCMOS) technology on a high resistivity wafer with deep p-well option. Capacitively coupled detectors are simple and low cost alternative to classical hybrid detectors and it can be used for several particle physics experiments.
The CCPD53 sensor chip contains a...
The Large Hadron Collider at CERN will be upgraded to the High-Luminosity-LHC and will deliver an instantaneous luminosity increased by a factor of 5 - 8 from 2026 on compared to now. In order to cope with the increased radiation level and hit rate, detectors with better radiation tolerance and higher data rate capabilities are demanded. Therefore, the ATLAS experiment, one of the four large...
High voltage CMOS pixel sensors will be used in several particle physics experiments for particle tracking. ATLASPIX3 is the first full reticle size monolithic HVCMOS sensor which has all necessary features for construction of multi chip modules. ATLASPIX3 has been designed for ATLAS pixel upgrade, layer 4, within ASTLAS CMOS collaboration. The size of the chip is 2cm x 2.1cm with periphery at...
This contribution presents the investigation of radiation damage on ATLASpix1_M2, which is one of the design variants of ATLASpix1 chip. ATLASpix1 is a large area (1 cm x 1.3 cm) High Voltage CMOS (HVCMOS) sensor prototype in 180nm technology. ATLASpix1_M2 is originally designed targeting the requirements of ATLAS ITk layer 4. It has a novel data transfer scheme from pixels to periphery where...
CMOS active pixel sensor technology has become extremely attractive for charged particle tracking at High Energy Physics experiments. It integrates both the sensing element and the signal processing circuitry on one single chip. It promises high spatial resolution, low cost and low material budget that are desirable for high performance tracking. Sensors fabricated with high voltage (HV)-CMOS...
Four hybrid active pixel detectors of Timepix3 technology, installed in the ATLAS experiment, were taking data from April 2018 until the end of Run-2 data taking period (December 2019). They are arranged in two stacks with face to face geometry allowing coincidence measurement of penetrating particles from the interaction point (IP) or beam pipe and are synchronized with the LHC orbit clock....
The Mu3e experiment will search for the charged lepton flavour violating decay $ \mu^{+} \to e^{+}e^{-}e^{+} $ with a sensitivity of one in $ 10^{16} $ decays (in phase II). To reach this sensitivity a momentum resolution of 0.5 MeV/c and a vertex resolution of about 200 $ \mu $m is required.
The particle rate is given by the more than $ 10^{9} $ muon stops per second. All the hits will be...
A new inner tracker (ITk) is to be installed inside the solenoid magnet of the upgraded ATLAS detector, to measure tracks of charged particles produced in the proton-proton collisions at the high-luminosity large hadron collider (HL-LHC) at CERN. Silicon strip detectors cover outer layers of ITk with $\sim$165 m$^{2}$ of silicon sensors, composed of "short strips" (2.41 cm long) and "long...
For the production of the Inner Tracker (ITk) as part of the phase-II upgrade programme to prepare the ATLAS experiment for the High-Luminosity (HL) LHC, batches of Long Strip (LS) and Short Strip (SS) \mbox{$n$-in-$p$} type micro-strip sensors have been produced by Hamamatsu Photonics.
The full size sensors measure approximately 98 x 98 mm$^{2}$ and are designed and engineered for...
The ATLAS Phase-II Upgrade for the High-Luminosity LHC features replacement of the Inner Detector with an all-silicon Inner Tracker (ITk). The majority of the instrumented area in ITk is occupied by strip modules covering 165 m^2. A vigorous R&D program has been on-going for many years to prepare for the scale of the project and to work out technical issues at all key components of the system,...
The ATLAS community is facing the last stages prior to the production of the upgraded silicon strip Inner Tracker (ITk) for the High Luminosity Large Hadron Collider (HL-LHC). An extensive Market Survey was carried out in order to evaluate the capability of different foundries to fabricate large area silicon strip sensors, satisfying ATLAS ITk specifications.
The semiconductor manufacturing...
The production of the strip sensors for the ATLAS Inner Tracker (ITk) will start in 2020. Nearly 22000 large area sensors will be produced over a period of roughly 4 years. The Institutes involved in the sensor development and production are committed to deliver and maintain the highest quality sensors for the experiment. A Quality Assurance (QA) strategy has been prepared to be carried out...
Silicon strip sensors for the ATLAS Inner Tracker (ITk) have been designed to provide reliable particle detection in the high-radiation environment of the High-Luminosity Large Hadron Collider. One important design criterion for their development is the minimisation of inactive sensor area (bias ring, guard ring and edge implant surrounding the active sensor area), as inactive sensor areas...
We have introduced for the very first time doping less charge plasma technique on Silicon based microstrip detectors. We have performed Synopsys TCAD 2D simulation study of these detectors to determine the breakdown voltage and post radiation effects for next generation microstrip detector for futuristic particle physics experiments. The simulation study of doping less charge plasma on Silicon...
The same charge sensitive preamplifier and discriminator circuit with different isolation strategies has been tested to compare the isolation of both analog and digital circuits from the substrate of a 65 nm bulk CMOS process to the isolation of only digital circuits, tying analog ground locally to the substrate. This study will show that the circuit with analog on the substrate and digital in...
Development of optical links with 850 nm multi-mode vertical-cavity surface- emitting laser (VCSEL) has advanced with the transmission rate achieving beyond 25 Gbps. For applications in high-energy experiments, the transceivers are required for tolerance in ionizing and particle radiation fields. We report on prototyping of a transmitter developed for high speed transmission with the...
Among the current and planned experiments of neutrinoless double-beta decay (0νββ), the high-pressure gaseous TPC stands out for its excellent energy resolution, low radioactive background and good scalability. Moreover, high position resolution can be maintained with an appropriate charge readout scheme for TPC to further suppress the background through ionization imaging. A low noise sensor,...
This paper present a low-power small-area six-transistor (6T) SRAM cell, which uses only one bit line and applies an additional switch to cut the competition path during the write access. The proposed 6T SRAM cell has been applied in a pixel array detector to configure a Digital-to-Analog Converter (DAC) in each pixel to improve the charge threshold uniformity. Compared to the conventional 6T...
The CBC3.1 is the final version of the CMS Binary Chip for readout of the outer radial region of the upgraded
CMS Tracker at the High Luminosity LHC. The development began a decade ago.
The 254-channel, 130 nm CMOS ASIC is designed to be bump-bonded
to a hybrid substrate to which sensors will be wire-bonded. It will instrument double-layer 2S-modules, containing two
overlaid silicon...
The UFSD group of Turin is working at the development of custom front-end electronics for the read-out of thin silicon sensors with moderate internal gain (the so called Ultra-Fast Silicon Detectors- UFSD), aiming at applications that require very precise time tagging. The activity of the group is mainly focused on meeting the requirements of the next generation of HEP colliders where the main...
VCSEL-based array optical data transmission system has been prevailingly researched and developed for the front-end data acquisition in high-energy physics experiments with advantages in density, data throughput, power consumption and radiation performance. This paper presents the design and test results of a 12-channel 12 x 10 Gbps VCSEL driving ASIC fabricated in 55nm CMOS technology. Each...
Optical data transmission, characterized by high data rate capacity, low power consumption and space saving, has been extensively used in the detector readout electronics in high-energy physics (HEP) experiments. The photodiode (PD)-based optical receiver array is a key component to build paralleled optical links at the receiving end. The light traveling through a fiber experiences optical...
We report on the mitigation of TID and SEE induced malfunctions for digital circuits fabricated in a 130 nm bulk SiGe BiCMOS technology using a novel RHBD approach. To avoid an increase of drain leakage for NMOS transistors and channel pinch-off for PMOS transistors due to trapped fixed positive charges at the lateral Shallow Trench Silicon interface we introduced a lateral junction isolation...
The 2-7GeV high intensity electron-positron accelerator (HIEPA), as one of the options for the new generation of particle physics test facility in China, is currently under pre-research stage. High energy resolution electromagnetic calorimeter (EMC) for measuring the energy and direction of photons and electrons is one of the important components in an accelerator. This abstract presents a...
The 2-7 GeV High Intensity Electron-Positron Accelerator (HIEPA) is one of the three options for the new generation of particle physics test facility in China, which can help test Quantum Chromodynamics (QCD) in low energy regions and find new physics theory. As one of the important components in the accelerator, the electromagnetic calorimeter (EMC) needs to measure the time information of...
The demand of high speed, low power analog-to-digital converter (ADC) is growing fast in future high energy physics experiments or in upgrade of current detectors. Also, the ADC becomes more and more critical in the front-end application specific integrated circuit (ASIC) design. Based on these considerations, a fully integrated, 10-bit 100MS/s successive approximation register (SAR) ADC with...
CdZnTe detectors are promising candidates for X-ray and gamma ray detecting, due to their good energy resolution, high detection efficiency and room temperature operation. They are suitable to be equipped in gamma spectrometers for energy measurement. Compared to board system, application specific integrated circuit (ASIC) features lower power consumption and smaller size. Especially for...
Due to its high atomic number, high detection efficiency and good energy resolution, the cadmium telluride (CdTe) semiconductor has been regarded as a promising material for hard X-ray observation. We have developed a front-end ASIC for a CdTe pixel detector for future hard X-ray astronomy missions. The ASIC is designed for a hybrid configuration so that each CdTe pixel can be vertically...
We develop a front-end ASIC for the silicon strip detector of the J-PARC muon g-2/EDM experiment, which aims to measure the muon anomalous magnetic moment and electric dipole moment to search for new physics beyond the Standard Model. In this experiment, we use a silicon strip detector with high granularity and fast response to detect positrons from muon decay. Since the timing of the muon...
In this paper, a large input-capacitance compensation method is proposed in order to improve the performance of a CSA designed for electromagnetic calorimeter (EMC) in high intensity electron-positron accelerator (HIEPA), which is one of the options for the new generation of particle physics test facility in China. Charge Sensing Amplifier (CSA) is an important unit which can convert input...
Medipix4 is the latest member of the Medipix family of pixel detector readout chips aimed at high rate spectroscopic X-ray imaging. Unlike its predecessors it will be possible to tile the chip on all 4 sides permitting seamless large area coverage. This presentation focuses on the development of a new architecture for the front-end of Medipix4 capable of event-by-event data processing allowing...
With the design and fabrication of integrated circuits entering the deep-submicron and nano-scale era, the possibility of radiation induced multiple cell upset (MCU) increases noticeably. Extracting the MCU characteristics (size, proportion, etc) from the observed radiation-induced upsets can provide useful information for designing hardening strategies and fault injection experiments, which...
Indium gallium arsenide (InGaAs) photodiodes have been widly used in space domain, such as satellite attitude control, optical communications, and satellite remote sensing. But when used in these environment, their will be damaged by particles or rays, which would lead to the parameter degradiation or even functional failure. The mainly radaition damage induced by particles or rays of InGaAs...
Charge coupled devices (CCDs) have been widely used as detectors for particle detection and space applications for their merits of low cost, small size and high sensitivity. Charge transfer inefficiency (CTI) degradations of the CCD detector used in harsh radiation environments are one of the main concerns of the detector performance. The CTI degradations are very sensitive to the displacement...
Envisaged high energy physics experiments like the Future Circular Collider require unprecedented radiation hardness of the detectors, as well as short readout time due to high luminosity and occupancy. Silicon has proven to be extremely radiation hard, clear and fast signals can be recorded even at fluences close to $1\cdot10^{16}~n_{eq}/\mathrm{cm}^2$.
The signal formation in silicon strip...
Envisaged circular hadron colliders challenge the existing silicon detector technologies in terms of unprecedented radiation doses and set stringent limits on the resolution and the material budget.
Since 2002 the RD50 Collaboration is dedicated to the development of radiation tolerant silicon detectors for high energy collider experiments. One promising approach for more radiation hard...
A significant aspect of the Phase-II Upgrade of the ATLAS detector is the replacement of the current Inner Detector with the ATLAS Inner Tracker (ITk). The ATLAS ITk is an all-silicon detector consisting of a pixel tracker and a strip tracker.
Sensors for the ITk strip tracker have been developed to withstand the high radiation environment in the ATLAS detector after the High Luminosity...
Many electronic systems are designed to work in the environment of radiation and should have the radiation tolerance ability. Particularly the Single Event Effect (SEL) could induce the latchup of CMOS Integrate Circuits (IC) and degrade the device functionality. Therefore, the study of test methods for SEL sensitive area of integrated circuits becomes an important subject which helps us...
Radiation damage effects at High Luminosity LHC (HL-LHC) expected fluences at the outer tracker layers greater than $1×10^{15}$ $n/cm^2$ 1 MeV equivalent, as well as total ionising doses on the order of 70 Mrad, will impose very stringent constraints in terms of radiation resistance of solid-state detectors, from both silicon substrate and silicon oxide.
In this contribution we address the...
The nuclear disaster at the Fukushima Daiichi Nuclear Power Plant (NPP) in Okuma, Fukushima, was initiated primarily by the tsunami following the Tohoku earthquake on March 11, 2011. After a large amount of radioactive substances was released into the environment of the region, the distribution of the radiation sources on the ground was monitored. However, there have been only few estimations...
Knowing the reliability of electronic systems operating under extreme conditions is crucial, especially in nuclear and space applications. In such environment, the proper functionality of electronic systems is endangered because of Single Event Effect (SEE) occurrence. In our work, we present an experimental setup for measuring fault detection correlated with events occuring in silicon...
Monolithic silicon pixel sensors combine the electronics and sensing layer in one silicon element and are produced in commercial CMOS processing lines without the need for a fine pitch interconnection technology as used for hybrid silicon pixel detectors. This reduces the overall cost, but also the complexity of the module assembly procedure. The sensors can be thinned to typical thicknesses...
The Belle II experiment aims to accumulate 50 ab$^{-1}$ of $e^+e^-$ collision data at the SuperKEKB asymmetric energy collider (Tsukuba, Japan). The first physics data using all Belle II detectors were taken in spring 2019.
In the vast physics program of the Belle II experiment, the vertex detector plays a crucial role for the determination of the B-mesons decay vertices. It consists of two...
During the Long Shutdown 3 (LS3) of the Large Hadron Collider (LHC), around 2024-2026, significant parts of the CMS detector will be upgraded to allow an efficient data taking during the subsequent High Luminosity LHC phase (HL-LHC). The HL-LHC will have a factor 5 higher instantaneous luminosity - resulting in a factor 5 higher event "pileup", and a factor 10 increase in integrated luminosity...
The ATLAS upgrade programme for the high-luminosity large hadron collider (HL-LHC) includes the replacement of the inner tracking detector with an all-silicon system. The outer layers of the new tracker consist of strip sensors and the inner region is made up of pixel sensors. The harsh radiation environment requires the pixel system to run at low temperature to minimise damage to the silicon...
In preparation for the High luminosity LHC (HL-LHC) upgrade, the whole ATLAS inner tracker will be replaced by a new silicon detector tracker. The innermost region will be covered by silicon pixel detectors as a high density of produced particles is expected. In order to operate in such an environment, high-resolution sensor and high-speed readout system is required. At the moment the RD53A,...
The ATLAS phase-I upgrade aims to enhance event triggers in the Liquid Argon (LAr) calorimeter and the forward muon spectrometer. The trigger signals are transmitted with customized optical transceivers at ~5 Gbps per channel in a radiation hazard. We report on the design, quality control in production and ageing tests of the transceivers fabricated with the LOCld laser driver circuits and...
An optical link system based on lpGBT and VTRx+ is being developed for the ATLAS Liquid Argon Calorimeter Phase-II upgrade. The optical link system is responsible to transmit the detector data and clocks/control signals for 1524 Front-End Boards (FEBs) through 26 optical fibers per FEB over 150 meters.
The optical links can be divided into two categories, data links and control links. For...
Solar neutron observations are important on understanding of nucleon acceleration mechanism in the Sun. However, previous ground-based observations with large area telescopes (∼10 m$^2$ ) at high latitude are not sensitive to solar neutrons due to attenuation in the earth atmosphere (roughly 10 detection since its discovery in 1980). From space, the SEDA-AP instrument with much smaller area...
We have been developing P-channel Charge-Coupled Devices (CCDs) for the upcoming X-ray Astronomy Satellite XRISM, planned to be launched in 2022. While the basic design of the CCD camera (Soft X-ray Imager; SXI) is almost the same as that of the lost Hitomi (ASTRO-H) observatory, we are planning to improve several critical points on the basis of Hitomi's in-orbit data. One of the largest...
In the soft gamma ray region (100 keV-10 MeV), Compton scattering is the dominant physical process, and It is an unexplored region where observation has not progressed because the background is rather high compared to the signal from celestial sources. In this region, the direction and energy of incident gamma rays can be determined by using Compton camera technique where photons are Compton...
This contribution describes design of Timepix-based hodoscope for cubesat applications, such as PilsenCube2, developed by the University of West Bohemia. This hardware platform consists of two Timepix detectors with silicon 500µm sensors, placed in face-to-face arrangement and rotated relative to each other by 90°, forming a telescope set-up. A copper separator is placed between two sensor...
X-ray Imaging and Spectroscopy Mission (XRISM) will be launched in early 2022. XRISM has a soft X-ray imaging telescope using X-ray mirror and CCD cameras, named "Xtend". In 2019, we have performed screenings to choose four flight-model (FM) CCD chips from twelve FM candidates provided by Hamamatsu Photonics company. After that, we performed on-ground calibration for the selected FM CCD chips....
Microbeam radiotherapy is a novel type of radiotherapy in which narrow beams of radiation (typically less than 500 µm) are spatially fractionated, delivering a non-uniform distribution to the target tumour volume. Due to the very high dose gradients involved, new dosimetric techniques are required for translation into clinical practise. Current real-time beam monitoring is typically performed...
The LHCb Vertex Detector (VELO) is currently being upgraded to a lightweight, pixel detector capable of 40 MHz readout and operation in very close proximity to the LHC beams. The thermal management of the system will be provided by evaporative CO2 circulating in micro channels embedded within 500 micron thin silicon plates. This solution has been selected due to the excellent thermal...
A beam telescope based on the Timepix3 ASIC was built in order to perform
detailed studies of VELO Upgrade prototypes using charged particle beams. The
telescope consists of 8 planes of hybrid pixel detectors with 300 um p-on-n
silicon sensors.
Tracks measured with the telescope have excellent spatial resolution, reaching under 2 um due to the
small (55x55 m2) pitch, per-pixel...
A 320kV ECR platform has been constructed at the Institute of Modern Physics in Lanzhou to deliver intense high charge state ion beams and medium charge state ion beams for atomic physics, material surface research and biology research. This ECR platform can accelerate the ions up to 300q kV. The dynamical range of the projectile velocity is from 0.3 a.u. to 2 a.u., covering electron capture...
The Phase-II upgrade of LHC to HL-LHC by 2026 allows an increase in the operational luminosity value by a factor of 5-7 that will result in delivering 3000~fb$^{-1}$ or more integrated luminosity. This amount of data will not just allow an increase in the precision of the Standard Model(SM) measurements but also widen the horizon for Beyond Standard Model(BSM) searches. To achieve high...
The IHEP HGTD group has recently developed their first version LGAD sensor. Electrical Characterization TCAD Simulation was tuned to get simultaneously high breakdown voltage and proper gain. N-JTE and P-stop are the critical structures to guarantee high breakdown voltage. The gain layer was optimized for proper gain factor and hence good time resolution. Fabrication process simulation was...
A High-Granularity Timing Detector (HGTD) , based on low-gain avalanche detector (LGAD) technology, is proposed for the ATLAS Phase-II upgrade. In order to operate in harsh environment in high luminosity LHC, One of the most important parameters of the HGTD is radiation hardness of the sensors and electronics. This contribution focuses on total ionization does (TID) effects on LGAD sensors...
In view of the high-luminosity Large Hadron Collider (HL-LHC) upgrade, the ATLAS, CMS, RD50 collaborations are developing new irradiation-hard silicon sensors for precision timing measurements using Low gain avalanche diode (LGAD). In China, Novel Device Laboratory in Beijing (NDL) and IHEP have fabricated several batches of LGAD sensors. The basic characterization of IHEP-NDL LGAD sensors...
We report on the layout and performance of Low-Gain Avalanche Detectors (LGAD) produced by HPK as prototypes for the HGTD in ATLAS. The HGTD is a multi-layer upgrade of the ATLAS detector of total area of 6.4m2 covering the pseudo-rapidity region between 2.4 and 4.0 with timing sensors with time resolution of 50 ps, representing the first large scale application of the LGAD.
With a common...
The MIP Timing Detector (MTD) of the Compact Muon Solenoid (CMS) is designed to provide precision timing information (with resolution of ~40 ps per layer) for charged particles, with hermetic coverage up to a pseudo-rapidity of |η|=3. This upgrade will reduce the effects of pile-up expected under the High Luminosity LHC running conditions and brings new and unique capabilities to the CMS...
We are conducting research on Low-Gain Avalanche Detector (LGAD), a semiconductor detector with excellent time resolution, which has a signal amplification function inside the sensor and can obtain a sufficiently large signal even with a thin detector. LGAD is currently researching applications for future accelerator experiments and PET-CT sensors for medical use, etc. We measured the...
