Session

Session6

16 Dec 2019, 11:00
Sun: B1F-Meeting rooms#4-6; Mon-Wed: B2F-RAN (International Conference Center Hiroshima)

Sun: B1F-Meeting rooms#4-6; Mon-Wed: B2F-RAN

International Conference Center Hiroshima

Peace Memorial Park, Hiroshima-shi

Presentation materials

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  1. Heinz Pernegger (CERN)
    16/12/2019, 11:00
    Pixel sensors for tracking
    ORAL

    The upgrade of the tracking detectors for the HL-LHC requires the development of novel radiation hard silicon sensors. The development of Depleted Monolithic Active Pixel Sensors (DMAPS) target the replacement of hybrid pixel detectors with radiation hard monolithic CMOS sensors. We designed, manufactured and tested DMAPS in the TJ180nm CMOS imaging technology with small electrodes pixel...

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  2. Christian Bespin (University of Bonn (DE))
    16/12/2019, 11:20
    Pixel sensors for tracking
    ORAL

    The planned upgrade of LHC leading to the High-Luminosity Large Hadron Collider (HL-LHC) imposes new requirements on the detectors in terms of particle rates and radiation. We have addressed these demands by developing depleted monolithic active pixel sensors (DMAPS) employing high resistivity substrates and high bias voltage at the same time. Full size pixel matrix prototypes with complete...

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  3. Yunpeng Lu (Chinese Academy of Sciences (CN))
    16/12/2019, 11:40
    Pixel sensors for tracking
    ORAL

    Circular Electron Positron Collider is proposed as the future higgs factory. There are two different detector concepts and their variants being in the process of optimization. In either concepts, the vertex sub-detector is important for the flavor tagging. The relevant physics cases require high spatial resolution, low occupancy and low material budget; and the operation condition requires low...

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  4. Prof. Philip Patrick Allport (University of Birmingham (UK))
    16/12/2019, 12:00
    Technologies
    ORAL

    Recent advances in CMOS imaging sensor technology have led to designs able to withstand much higher radiation levels, up to those required at hadron colliders for all but the innermost layers. Also, with stitching, wafer scale devices have been fabricated on the same process as used for the prototypes described in this submission, for applications such as, for example, direct electron...

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