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20–24 Sept 2010
Aachen, Germany
Europe/Zurich timezone

Session

Packaging and Interconnects

22 Sept 2010, 15:05
Aachen, Germany

Aachen, Germany

RWTH Aachen University Templergraben 55 52056 Aachen

Conveners

Packaging and Interconnects: Parallel Session A4

  • Ray Yarema (FNAL)

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15:00
16:00
Mr Sami Vaehaenen
Low-cost bump bonding activities at CERN
Aula
15:05 - 15:30
Mr Ashley Greenall
Design and Performance of Serial Powered Single-Sided Modules within an Integrated Stave Assembly for the ATLAS Tracker Barrel Upgrade
Aula
15:30 - 15:55
Michael Beimforde
SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC
Aula
15:55 - 16:20