Speaker
Frank Hartmann
(KIT - IEKP)
Description
CMS ordered a large variety of wafers in different thicknesses and technologies at HPK.
Thicknesses from 50 - 300um are explored on floatzone, magnetic Czochralski and EPI material. Wafers are all coming in p-in-n and n-in-p versions.
Every wafer contains different structures to answer different questions, e.g. geometry, Lorentz angle, radiation tolerance, annealing behaviour.
Author
Frank Hartmann
(KIT - IEKP)
