22–26 Jul 2024
CICG - GENEVA, Switzerland
Europe/Zurich timezone

Mechanical and physical properties of AlMgSc-alloy developed for cryogenic temperature applications

23 Jul 2024, 14:00
2h
Poster area

Poster area

Poster Presentation (120m) ICMC 10: Structural and 3D printed materials processing and properties Tue-Po-1.4

Speaker

Zahra Abbasi (Karlsruhe Institute of Technology, Institute for Technical Physics)

Description

Aluminum alloys, by virtue of their lightweight, good formability, and good corrosion resistance, are widely used in aerospace, construction, and automotive applications. The recently introduced AlMgSc-alloy, namely Scalmalloy® CX by APWORKS, processed by Selective Laser Melting (SLM) with high specific strength and a lightweight structure with minimal design constraints has enormous application possibilities, particularly at cryogenic temperatures. This alloy exhibits the highest yield strength (YS), ultimate tensile strength (UTS), and elongation among the aluminum alloys manufactured by SLM. These advantages have prompted research at the Karlsruhe Institute of Technology (KIT) on the mechanical and physical characteristics for the purpose of prospective applications at cryogenic temperatures. Tensile and fracture measurements conducted at various temperatures demonstrated the novel alloy’s higher fracture toughness when compared to conventional Scalmalloy®. The developed cryogenic version showed a rise in fracture toughness to 13.4, 20, and 43 MPa√m at 20K, 77K, and room temperature, compared to the standard version's 9.5, 10.8, and 28 MPa√m. This improvement in fracture toughness comes at the expense of ultimate tensile strength although the reduced UTS value is still within the range of high strength aluminum alloys. Microstructural and microhardness observation depicted the direct influence of distribution and size of precipitations as well as their volume fraction on the mechanical properties.

Submitters Country Germany

Primary author

Zahra Abbasi (Karlsruhe Institute of Technology, Institute for Technical Physics)

Co-authors

Camelia Schulz (KIT, Institute for Technical Physics) Klaus-Peter Weiss (KIT, Institute for Technical Physics)

Presentation materials