Speakers
Description
The ColorPix ASIC, currently in its third revision, is a hybrid pixel detector designed for spectral X-ray imaging. It is implemented in 65 nm CMOS technology and features a 32 × 32 pixel matrix, with scalability toward future expansion up to 256 × 256 pixels. The pixel pitch is 70 µm. A 2 mm-thick CZT (cadmium zinc telluride) sensor layer, which is highly sensitive to X-rays, is bump-bonded to the chip. The detector operates in photon-counting mode, acquiring data across 10 configurable energy bins using 12-bit counters. Compared to traditional imaging detectors, this approach significantly enhances material composition analysis capabilities. In this work, we present the first measurements obtained with the ColorPix-3 chip, along with selected simulation results.