- Markus Friedl (Austrian Academy of Sciences (AT))
- Hartmut Sadrozinski (SCIPP, UC santa Cruz)
Niklaus Berger (Uni Heidelberg)
The Mu3e experiment searches for the lepton flavour violating decay μ+→e+e-e+, aiming for a branching fraction sensitivity of 10-16. This requires an excellent momentum resolution for low energy electrons, high rate capability and a large acceptance. In order to minimize multiple scattering, the amount of material has to be as small as possible. These challenges can be met with a tracker built...
Jerome Baudot (Institut Pluridisciplinaire Hubert Curien (FR))
CMOS pixel sensors (CPS) with a column parallel read-out architecture and developed in a 0.35 um technology have already met the requirements of several high energy projects (EUDET, STAR-HFT, ILC) where spatial resolution and material budget govern the specifications. The full potential of CPS is however not yet reached, and can answer the demand of future vertex detectors (ALICE, SuperB, eIC)...
Dr Toshinobu Miyoshi (High Energy Accelerator Research Organization (JP))
Truly monolithic pixel detectors were fabricated with 0.2 um SOI pixel process technology by collaborating with LAPIS Semiconductor Co., Ltd. for particle tracking experiment, X-ray imaging and medical application. CMOS circuits were fabricated on a thin SOI layer and connected to diodes formed on the silicon handle wafer through the buried oxide layer. We can choose the handle wafer and...
erik ramberg (Fermilab)
For several years, Fermilab has been heavily involved in the development of novel 3-dimensional analog and digital ASIC circuits. These devices consist of thinned wafer layers with circuits bonded to each other to act as monolithic forms. Communication between the layers and across the stacks is achieved with micron-size through-silicon-vias. Enabling a new dimension in integrated circuits...
140. The first fully functional 3D CMOS chip with Deep N-well active pixel sensors for the ILC vertex detector
Dr Gianluca Traversi (University of Bergamo)
This work presents the characterization of Deep N-Well (DNW) active pixel sensors fabricated in a vertically integrated technology. The DNW approach takes advantage of the triple well structure to lay out a sensor with relatively large charge collecting area (as compared to standard three transistor MAPS), while the readout is performed by a classical signal processing chain for capacitive...
47. The TDCpix readout ASIC: a 75 ps resolution timing front-end for the NA62 Gigatracker hybrid pixel detector
Alex Kluge (CERN)
The TDCpix is a novel pixel readout ASIC for the NA62 Gigatracker detector. NA62 is a new experiment being installed at the CERN Super Proton Synchrotron. Its Gigatracker detector shall provide on-beam tracking and time stamping of individual particles with a time resolution of 150 ps rms. It will consist of three tracking stations, each with one hybrid pixel sensor. The peak flow of particles...
Prof. Lawrence Pinsky (University of Houston (US))
A talk was given at the last VCI demonstrating the capabilities of the pixel detector technology developed by the CERN-based Medipix2 Collaboration and outlining the plans to develop dosimeters and radiation area monitors for use in characterizing space radiation. In the interim, a number of devices have been sent to the International Space Station and are being used to obtain operating these...