AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Name: AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors
Start: 2013-04-08T09:00:00+02:00
End: 2013-04-09T15:10:00+02:00
Location: LNF

8–9 Apr 2013

LNF

Europe/Zurich timezone

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3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results

8 Apr 2013, 18:40

20m

LNF, Auditorium Touschek

Through-Silicon Vias (TSV)

David HENRY (CEA-LETI-MINATEC)

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LETI-Medipix_status-08-04-13.pptx

AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

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3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results

LNF, Auditorium Touschek

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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

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