AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Name: AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors
Start: 2013-04-08T09:00:00+02:00
End: 2013-04-09T15:10:00+02:00
Location: LNF

8–9 Apr 2013

LNF

Europe/Zurich timezone

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development of HV CMOS - sensors for 3D integration

9 Apr 2013, 09:45

15m

LNF, Auditorium Touschek

Integration of sensors with 3D electronics

Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))

Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))

Slides

Frascati_2013ivanperic.pdf

Frascati_2013ivanperic.pptx

AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

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development of HV CMOS - sensors for 3D integration

LNF, Auditorium Touschek

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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

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Presentation materials