AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Session

Integration of sensors with 3D electronics

9 Apr 2013, 09:15

LNF

Conveners

Integration of sensors with 3D electronics

• Valerio Re (INFN)

47. SiPM Interconnections to 3D electronics

Jelena Ninkovic (Max PlanckInstitute for Physics)

09/04/2013, 09:15

49. Perspective of the sensor interconnectivity to the TSV readout ASIC

Juha Kalliopuska (University of Helsinki Faculty of Science)

09/04/2013, 09:30

50. development of HV CMOS - sensors for 3D integration

Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))

09/04/2013, 09:45

51. Vertical Integration techniques used for MEMS

Mr Lutz Hofmann (Fraunhofer ENAS)

09/04/2013, 10:00

52. IMEC's activities in imagers and imager stacking

Piet De Moor (IMEC)

09/04/2013, 10:15

54. Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics

Haemisch York (Philips Technologie GmbH)

09/04/2013, 10:30

55. Capacitively coupled active sensors in 180nm HV-CMOS technology

Daniel Muenstermann (CERN)

09/04/2013, 10:45

57. Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology

JCC Clemens (Centre National de la Recherche Scientifique (FR))

09/04/2013, 11:00

58. IPDiA's Interposer and TSV solutions

Stephane Bellenger (Belletech)

09/04/2013, 11:15