Login

AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

8–9 Apr 2013
LNF
Europe/Zurich timezone

Support

Session

Integration of sensors with 3D electronics

9 Apr 2013, 09:15
LNF

LNF

Conveners

Integration of sensors with 3D electronics

  • Valerio Re (INFN)

Presentation materials

There are no materials yet.

  1. 47. SiPM Interconnections to 3D electronics
    Jelena Ninkovic (Max PlanckInstitute for Physics)
    09/04/2013, 09:15
  2. 49. Perspective of the sensor interconnectivity to the TSV readout ASIC
    Juha Kalliopuska (University of Helsinki Faculty of Science)
    09/04/2013, 09:30
  3. 50. development of HV CMOS - sensors for 3D integration
    Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))
    09/04/2013, 09:45
  4. 51. Vertical Integration techniques used for MEMS
    Mr Lutz Hofmann (Fraunhofer ENAS)
    09/04/2013, 10:00
  5. 52. IMEC's activities in imagers and imager stacking
    Piet De Moor (IMEC)
    09/04/2013, 10:15
  6. 54. Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics
    Haemisch York (Philips Technologie GmbH)
    09/04/2013, 10:30
  7. 55. Capacitively coupled active sensors in 180nm HV-CMOS technology
    Daniel Muenstermann (CERN)
    09/04/2013, 10:45
  8. 57. Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology
    JCC Clemens (Centre National de la Recherche Scientifique (FR))
    09/04/2013, 11:00
  9. 58. IPDiA's Interposer and TSV solutions
    Stephane Bellenger (Belletech)
    09/04/2013, 11:15
Building timetable...